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USB 2.0 picoPHY in UMC (40nm, 28nm)
The Synopsys DesignWare® USB 2.0 picoPHY provides designers with a complete physical (PHY) layer IP solution, designed for low power mobile and consumer applications such as feature-rich smartphones and mobile internet devices. The DesignWare USB 2.0 picoPHY IP delivers 30% smaller die area and lower leakage compared to USB 2.0 nanoPHY IP products, for reduced silicon cost and longer battery life. Optimized for mobile and consumer electronic applications, the DesignWare USB 2.0 picoPHY supports the USB Type-C specification and implements the Battery Charger (version 1.1) and USB On-The-Go (OTG) version 2.0 specifications. Architected for the industry's most advanced 1.8V process technologies, the USB 2.0 picoPHY is designed to minimize effects due to variations in foundry process, device models, package and board parasitics.
The DesignWare USB 2.0 picoPHY builds on years of customer success with Synopsys’ silicon-proven USB PHY IP product line, which has been ported to over 100 process nodes and configuration combinations ranging from 90-nm to 14/16-nm FinFET. When combined with the DesignWare digital controllers and verification IP, the DesignWare USB 2.0 picoPHY delivers a complete low power and small die area solution for advanced system-on-chip (SoC) designs.
The DesignWare USB 2.0 picoPHY builds on years of customer success with Synopsys’ silicon-proven USB PHY IP product line, which has been ported to over 100 process nodes and configuration combinations ranging from 90-nm to 14/16-nm FinFET. When combined with the DesignWare digital controllers and verification IP, the DesignWare USB 2.0 picoPHY delivers a complete low power and small die area solution for advanced system-on-chip (SoC) designs.
Features
- Complete mixed-signal physical layer for single-chip USB 2.0 OTG and non-OTG applications
- Small PHY macro area
- Low power
- Advanced power management features, including support for power supply gating, supply scaling, ultra-low standby current support, and power management unit (PMU) interrupt support
- OTG 2.0 support including Attach Detection Protocol (ADP)
- Supports all OTG features, including Host Negotiation Protocol (HNP) and Session Request Protocol (SRP) Battery Charger v1.1 support, including the latest Accessory Charger Adapter (ACA) functionality Enhanced test capabilities includes added CDR margin testing, automatic test packet generation, and reduced pin count test requirements via multiplexing of ID pin
- Enhanced Reference Clock support for mobile and low-cost applications including 9.6, 10, 12, 19.2, 20, 24, and 50MHz
Benefits
- The DesignWare USB 2.0 picoPHY is designed for advanced CMOS digital logic processes
- Integrates high-speed, mixed-signal custom CMOS circuitry designed to the UTMI+ Level 3 specification Supports the USB 2.0 480 Mbps protocol and data rate (Hi-Speed)
- Backwards compatible with USB 1.1 operating at 1.5 Mbps (Low-Speed) and 12 Mbps (Full-Speed)
- Can be used in USB Device, Host, or On-The-Go applications
- Supports the USB Type-C™ connector standard
Applications
- Digital cameras and camcorders
- USB video products
- Wireless routers and networking
- Gaming
- Storage
- Smartphones
- Tablets and ultrabooks
- Set-top boxes
Video Demo of the USB 2.0 picoPHY in UMC (40nm, 28nm)
USB 2.0 has been around for over 20 years and is the world's most popular wired interconnect standard. Join Morten Christiansen and Gervais Fong as they discuss how the new eUSB2 standard enables USB 2.0 connectivity for SoCs in the most advanced process nodes.
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