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USB 3.0 Super Speed PHY - SMIC 130-nm
AlgolTek's digniPHY for USB 3.0 is a Physical Layer IP compliant with the USB 3.0 specification, and is backward compatible to support 3rd party or customers' proprietary USB 2.0 IP that is USB 2.0 specification compliant. digniPHY is the first product in AlgolTek's SuperSpeed IP portfolio to leverage SMIC's 0.13-micron technology node, providing a balance of high performance, lower power consumption and cost-effective manufacturing.
The newly released digniPHY for USB 3.0 IP has also passed the USB-logo compliance test suite, including the USB 3.0 Electrical Test, Link Layer Test and Interoperability Test at the system level.
The newly released digniPHY for USB 3.0 IP has also passed the USB-logo compliance test suite, including the USB 3.0 Electrical Test, Link Layer Test and Interoperability Test at the system level.
View USB 3.0 Super Speed PHY full description to...
- see the entire USB 3.0 Super Speed PHY datasheet
- get in contact with USB 3.0 Super Speed PHY Supplier
superspeed USB 3.0 IP
- USB 3.0 femtoPHY in TSMC (28nm, 16nm, 12nm)
- USB 3.0 femtoPHY, Type-C in TSMC (28nm, 16nm, 12nm)
- USB 3.0 PHY in TSMC (65nm, 55nm, 40nm, 28nm)
- USB 3.0 SuperSpeed Device Controller (USB-IF Certified)
- USB 3.0 SuperSpeed Dual Role Device Controller (USB-IF Certified)
- USB 3.0 SuperSpeed PC Host Controller (USB-IF Certified)