www.sammyfans.com, May. 25, 2025 –
The semiconductor market is taking new turns in AI technologies, and Samsung is planning a major shift in its packaging solutions by adapting Glass Substrate for 2028 for high-performance AI chipsets.
According to Etnews, Samsung is preparing for the future semiconductor market and plans to introduce glass substrates to improve packaging. This can be done by replacing Silicon interposers with Glass Interposers, and the original plan to complete this transition is expected for 2028.
Interposers are intermediate substrates and an important part of chipsets. AI semiconductors have a 2.5D package structure with a graphics processing unit (GPU) in the middle and high bandwidth memory (HBM) around. The interposer works as a passage between the GPU and the HBM.
As of now, Samsung has been using silicon interposers, which provide a high-speed data rate and thermal conductivity. Still, these interposers are expensive, increasing process cost, and leading to high-cost manufacturing. Glass interposers are a suitable alternative with easy implementation and output high semiconductor performance, while reducing production cost.
Based on the market research, top industry players are finding ways to replace interposers and the main board with glass. Before providing this solution to customers, Samsung could apply a glass substrate to its semiconductors and HMB products.
To reach the final milestone, Samsung has been preparing a glass substrate supply chain, and discussions with its partners are still underway. The Korean tech maker will utilize glass interposers in units that are customized to chip size rather than glass substrates. Usually, the glass substrates are processed in 512×515 mm-sized substrates and then optimized according to the chip size. On the other hand, Samsung is going with the glass at 100×100mm or smaller.