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Foundry News
Can GFS' Manufacturing Expansion Boost Its Future Growth Prospects?
(Thursday, October 22, 2026)
Scaling infrastructure, all-in on NPO, and a "material-rich" road map: Themes and takeaways from Soitec’s 2026 Silicon Photonics Workshop
(Thursday, October 22, 2026)
IBM and Siemens team up to advance 3D nanostack chip technology
(Monday, October 19, 2026)
TSMC to Double 2nm Production Capacity by 2027, Widening Gap with Samsung Foundry to 66.6 Percentage Points
(Monday, October 19, 2026)
Samsung May Acquire a Silicon Photonics Company to Challenge TSMC
(Monday, October 19, 2026)
GlobalFoundries selected to operate two new semiconductor fabs in New York under landmark U.S.-Japan initiative
(Thursday, October 15, 2026)
GlobalFoundries Returns to Advanced-Node Race With 7 nm-Class FDX Fusion
(Thursday, October 15, 2026)
Cadence Wins Five 2026 TSMC OIP Partner of the Year Awards
(Thursday, October 15, 2026)
Manfred Horstmann: GlobalFoundries Bets on FDX Fusion for Physical AI
(Monday, October 12, 2026)
GF unveils roadmap to deliver the world’s most advanced FD-SOI platform for Physical AI
(Monday, October 12, 2026)
GlobalFoundries reaches agreement to establish U.S.-based supply of silicon interposers for advanced AI packaging
(Monday, October 12, 2026)
Xanadu and GlobalFoundries Announce Strategic Partnership to Accelerate Utility-Scale Quantum Manufacturing
(Thursday, October 8, 2026)
SkyeChip joins Rapidus ecosystem for Japan's 2nm chip platform
(Thursday, October 8, 2026)
Aion Silicon Named Design Solution Associate in New Rapidus CORE Ecosystem for 2nm Semiconductors
(Wednesday, October 7, 2026)
Rapidus Unveils "Rapidus CORE", New Global Ecosystem Framework Supporting the Development and Mass Production of Cutting-Edge Semiconductors
(Monday, October 5, 2026)
Panther Lake Teardown Shows Intel 18A Near TSMC N3E, Newer TSMC Nodes Still Ahead
(Monday, October 5, 2026)
Synopsys Earns Five TSMC Open Innovation Platform Partner of the Year Awards for Advancing AI-Driven Semiconductor Innovation
(Monday, October 5, 2026)
TSMC’s 3-nm Ramp Looks Different in Historical Context
(Thursday, October 1, 2026)
Silicon Creations Receives 10th Consecutive TSMC OIP Partner of the Year Award for Mixed Signal IP
(Thursday, October 1, 2026)
Samsung considers expanding 4nm capacity as HBM4 demand rises
(Monday, September 28, 2026)
SMART Photonics Partners with GlobalFoundries to Offer Industry’s First Open Access Foundry Service for Integrated Silicon and Indium Phosphide Photonics Products
(Thursday, September 24, 2026)
IC-Link by imec expands collaboration with TSMC to accelerate customer access to advanced-node chip design infrastructure and support
(Thursday, September 24, 2026)
M31 and Ambiq Collaborate on TSMC N12e® Foundation IP to Address Demanding SoC Power and Area Targets
(Thursday, September 24, 2026)
Siemens and TSMC advance AI-powered semiconductor design automation
(Thursday, September 24, 2026)
Cadence Collaborates With TSMC to Deliver Certified Tool Solutions and Industry-Leading, Silicon-Proven UALink IP on TSMC Advanced Processes
(Thursday, September 24, 2026)
Synopsys and TSMC Partner to Accelerate AI Systems Innovation with Agentic AI and Advanced Design
(Thursday, September 24, 2026)
GlobalFoundries and Marvell expand collaboration for next-generation optical connectivity
(Monday, September 21, 2026)
Samsung Starts 2nm AI5 Chip Production for Tesla FSD and Optimus
(Monday, September 21, 2026)
TSMC Scores Another 2nm Win: MediaTek's Dimensity 9600 Pro to Use N2P Process
(Monday, September 21, 2026)
Samsung and Qualcomm reopen 2nm talks as yield gap with TSMC narrows
(Wednesday, September 16, 2026)
GlobalFoundries and Monolithic Power Systems form manufacturing partnership to scale high-performance power solutions
(Monday, September 14, 2026)
SMIC Outgrows TSMC and Samsung With 20% Surge, Overtaking GlobalFoundries as World’s Third-Largest Foundry
(Monday, September 14, 2026)
Intel Resolves 18A Yield Variability; A Storm to Engulf Samsung and TSMC?
(Monday, September 14, 2026)
Samsung Electronics and ASML expand strategic collaboration for next-generation semiconductor manufacturing
(Thursday, September 10, 2026)
Intel Foundry and ASML Collaborate to Accelerate Industry Readiness for High NA EUV
(Thursday, September 10, 2026)
ASML and TSMC Announce Initiative to Pioneer Industry Transition to Large-Format Photomasks for High NA EUV
(Thursday, September 10, 2026)
Samsung Teams Up with Arm to Develop 2nm On-Device AI Chip; OpenAI Rumored as Potential Customer
(Monday, September 7, 2026)
GlobalFoundries announces customer availability of UX platform technologies for intelligent edge, connectivity and Physical AI applications
(Thursday, September 3, 2026)
GlobalFoundries and RAAAM Memory Technologies announce the joint development of next-generation GCRAM technology and test chip on FDX platform
(Thursday, September 3, 2026)
TSMC's new verification line in Kaohsiung signals shift towards advanced packaging dominance
(Thursday, September 3, 2026)
Q2 Foundry Market Grows 29%... TSMC Dominates with 73% Share, Samsung Stuck at 7%
(Monday, August 31, 2026)
Samsung’s 4nm GAIA Could Mark First PIM Commercialization in AI PCs, Mass Production as Early as 2027
(Monday, August 31, 2026)
UMC Shares Climb 6% on AI Foundry Investment Defying Market’s Semiconductor Downturn
(Thursday, August 27, 2026)
TSMC’s HBM-Packaging Yield Issues Help Intel, Analysts Say
(Thursday, August 27, 2026)
Rapidus Targets 8-Reticle Interposers on 600 mm Advanced Packaging Panels by 2030
(Monday, August 24, 2026)
TSMC Completes Development of 1.6nm A16 Process; Mass Production Set for Q4
(Monday, August 24, 2026)
Socionext Broadens SoC Roadmap with Intel 18A-P Process Technology
(Thursday, August 20, 2026)
The changing role of the foundry
(Thursday, August 20, 2026)
TSMC Doubles Advanced Packaging Capacity Over Three Years, Samsung Goes All-In on 2nm Mass Production
(Monday, August 17, 2026)
Intel 14A Design Ecosystem Gains Support from Major EDA Partners
(Monday, August 17, 2026)
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