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Foundry News

• Making Technology Real: GlobalFoundries' Vision for the Future (Monday, June 2, 2025)
• TSMC to Open EU Design Center in Munich in Q3 (Thursday, May 29, 2025)
• TSMC to Open First European Design Center in Munich by Q3 2025, Focusing on AI and Automotive (Wednesday, May 28, 2025)
• TSMC dazzles in Amsterdam (Wednesday, May 28, 2025)
• AMD sees TSMC as the clear favorite for 2nm, but Samsung remains in the game (Monday, May 26, 2025)
• Samsung to use Glass Substrate for Semiconductor manufacturing in 2028 (Sunday, May 25, 2025)
• GlobalFoundries partners with A*STAR to accelerate advanced packaging innovation (Thursday, May 22, 2025)
• GlobalFoundries partners with A*STAR to accelerate advanced packaging innovation (Tuesday, May 20, 2025)
• Samsung Reportedly Revises High-NA EUV Plans: Limited Memory Use, Foundry Begins at 1.4nm (Friday, May 16, 2025)
• Synopsys ramps up collaboration with Taiwan's TSMC on A16 process (Wednesday, May 14, 2025)
• SMIC Q2 revenues to take 6% hit due to tool maintenance and validation issues (Tuesday, May 13, 2025)
• EDA Companies Throw Support Behind TSMC's New A14 Process (Wednesday, May 7, 2025)
• Rapidus Starts Path to Advanced Chipmaking in Japan Government-backed startup's 2-nanometer pilot production gets underway (Wednesday, May 7, 2025)
• Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies (Wednesday, April 30, 2025)
• Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications (Wednesday, April 30, 2025)
• Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC (Wednesday, April 30, 2025)
• SkyeChip Joins Intel Foundry Accelerator IP Alliance (Wednesday, April 30, 2025)
• Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs (Wednesday, April 30, 2025)
• Intel tweaks its 18A process with variants tailored to mass-market chips, big AI brains (Wednesday, April 30, 2025)
• IC'Alps joins Intel Foundry Accelerator program as Value Chain Alliance (VCA) and Design Services Alliance (DSA) partner (Wednesday, April 30, 2025)
• Enabling the next generation of smart glasses (Wednesday, April 30, 2025)
• Keysight EDA and Intel Foundry Collaborate on EMIB-T Silicon Bridge Technology for Next-Generation AI and Data Center Solutions (Tuesday, April 29, 2025)
• QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip (Monday, April 28, 2025)
• Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration (Monday, April 28, 2025)
• Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale (Monday, April 28, 2025)
• Certus Semiconductor Joins TSMC IP Alliance Program to Enhance Custom I/O and ESD Solutions (Wednesday, April 23, 2025)
• Analog Bits to Demonstrate IP Portfolio on TSMC 3nm and 2nm Processes at TSMC 2025 Technology Symposium (Monday, April 21, 2025)
• Analog Bits to Demonstrate IP Portfolio on TSMC 3nm and 2nm Processes at TSMC 2025 Technology Symposium  (Monday, April 21, 2025)
• AMD Achieves First TSMC N2 Product Silicon Milestone (Wednesday, April 16, 2025)
• Samsung achieves 40%+ test yields with 4nm logic die (Wednesday, April 16, 2025)
• Samsung Reportedly Begins 1nm Process Development, Targets 2029 Mass Production (Thursday, April 10, 2025)
• Major Manufacturing Shake-up: Intel Agrees to TSMC Takeover of Chip Foundries, Sources Say (Thursday, April 3, 2025)
• Japan's Rapidus in talks with Apple, Google to mass-produce chips, Nikkei reports (Thursday, April 3, 2025)
• Silicon Photonics and Co-Packaged Optics Shine a Light at OFC 2025 (Thursday, April 3, 2025)
• GUC Announces Tape-Out of the World's First HBM4 IP on TSMC N3P (Wednesday, April 2, 2025)
• GlobalFoundries and UMC Mull Potential Merger (Monday, March 31, 2025)
• Intel brings 3nm production to Europe in 2025 (Thursday, March 27, 2025)
• How Soitec Engineers Substrates for Cloud and Edge AI (Thursday, March 27, 2025)
• X-FAB, SMART Photonics, and Epiphany Design Collaborate on Advanced Heterogeneous Photonics Integration Platform (Wednesday, March 26, 2025)
• TSMC Reportedly Speeds Up AP7 and AP8 Build-Outs, Targets Doubling SoIC Capacity (Tuesday, March 25, 2025)
• Rapidus Announces Strategic Partnership with Quest Global to Enable Advanced 2nm Solutions for the AI Chip Era (Monday, March 24, 2025)
• FAMES Pilot Line Launches Open-Access Call for Chip Industry (Tuesday, March 18, 2025)
• Soitec contributes to accelerated development of integrated optical connectivity solutions for AI datacentres with its silicon photonics SOI technology (Tuesday, March 18, 2025)
• Samsung Rumored to Mull on Scrapping 1.4nm Node to Prioritize 2nm/3nm Yield Gains (Monday, March 17, 2025)
• Cadence Joins Intel Foundry Accelerator Design Services Alliance (Sunday, March 16, 2025)
• InPsytech Joins Intel Foundry Accelerator IP Alliance to Boost HPC, AI, And Automotive Applications (Thursday, March 13, 2025)
• Japan's Rapidus Preps 2nm Foundry Process And Chiplets (Thursday, March 13, 2025)
• GUC Announces Successful Launch of Industry's First 32G UCIe Silicon on TSMC 3nm and CoWoS Technology (Wednesday, March 12, 2025)
• Intel Foundry's Moment of Truth: Will 18A Deliver? (Wednesday, March 5, 2025)
• Broadcom, NVIDIA Reportedly Running Test Chips Through Intel's Foundry Business (Monday, March 3, 2025)