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• Tesla-Samsung AI5 Chip Hits Tape-Out at Taylor Fab on 2nm Process (Monday, July 13, 2026)
• Rapidus to match TSMC on 2-nanometer chip pricing, Japan firm’s president says (Monday, July 13, 2026)
• MOSIS 2.0 and GlobalFoundries Partnership: A Strategic Alliance for Semiconductor Innovation (Thursday, July 9, 2026)
• Rapidus Pursues 2-nanometer Semiconductor Production in Japan (Thursday, July 9, 2026)
• TSMC Highlights 2nm and Advanced Packaging Progress (Thursday, July 9, 2026)
• US Media: Samsung and Anthropic Discuss Collaboration on 2nm AI Chips and Advanced Packaging (Monday, July 6, 2026)
• Samsung Reaffirms 1.4nm Chips for 2029 and Adds an Enhanced SF1.4+ Node (Monday, July 6, 2026)
• Samsung Unveils AI Foundry Ecosystem Push (Thursday, July 2, 2026)
• Samsung resumes 1.4nm chip development, targets 2029 mass production (Thursday, July 2, 2026)
• IBM Unveils Sub-1nm Chip Tech with 50% Performance Boost (Monday, June 29, 2026)
• Global Foundry 2.0 Revenue Rises 23% YoY in Q1 2026 as AI Continues to Boost Demand (Monday, June 29, 2026)
• TSMC (NYSE:TSM) Is Raising 7nm Chip Prices Up To 10% As Expansion Builds (Monday, June 29, 2026)
• Advanced USB Connectivity IP Validated on N2P Process Technology (Monday, June 29, 2026)
• GlobalFoundries qualifies SLATE™ advanced packaging technology on 9SW platform for next-generation radio frequency applications (Thursday, June 25, 2026)
• Samsung Foundry Reportedly in Talks with AMD for 2028 CPU Production as BYD, Google Consider Its Services (Monday, June 22, 2026)
• Report: Intel Partners With Taiwan’s UMC on 3nm Chips, Taking Direct Aim at TSMC’s Foundry Dominance (Monday, June 22, 2026)
• Rapidus Signs MoU with Fondazione Chips-IT in Italy for Future Semiconductor ManufacturingNew collaboration provides framework between the Japan government and Italy (Monday, June 22, 2026)
• UK Semiconductor Centre and Rapidus partner to expand access to advanced chip technologies (Thursday, June 18, 2026)
• Intel Foundry Details Process Milestones and Future Innovation at VLSI Symposium (Thursday, June 18, 2026)
• ASML, TSMC and imec bring industry-ready 2D-material transistors closer with breakthrough 300mm integration (Thursday, June 18, 2026)
• Strong AI Demand and Early Consumer Electronics Inventory Build Drive Top 10 Foundries to 3.7% QoQ Revenue Growth in 1Q26 (Monday, June 15, 2026)
• CEA‑Leti Advances European FD-SOI Innovation with GlobalFoundries’ Collaboration in the FAMES Pilot Line (Monday, June 15, 2026)
• Samsung and Nvidia Partnership Upgrade: HBM4E, HBM5 and Autonomous Driving Chip Foundry Enter Substantial Discussions (Monday, June 15, 2026)
• Samsung Says Nvidia Partnership Extends Beyond HBM to Foundry Collaboration (Thursday, June 11, 2026)
• Cadence Announces Collaboration with Intel Foundry to Accelerate Intel 14A Process Optimization for HPC and Mobile Designs (Wednesday, June 10, 2026)
• Rapidus Completes 150 Billion Yen Funding Round from Japan Government (Monday, June 8, 2026)
• Intel CEO says TSMC a ‘partner’ in chip production (Monday, June 8, 2026)
• Samsung’s 2nm Advance Draws on EDA Innovation from Cadence, Siemens, and Synopsys (Monday, June 8, 2026)
• Samsung Foundry Reportedly in Talks With Chinese Carmakers Like BYD for 2nm, 4nm Autonomous Driving SoCs (Thursday, June 4, 2026)
• NVIDIA and TSMC Bring AI Into Fabs to Advance Semiconductor Design and Manufacturing (Thursday, June 4, 2026)
• Synopsys Advances Power and Performance for AI and Multi-Die Designs on Latest Samsung Foundry Processes at SAFE Forum 2026 (Monday, June 1, 2026)
• Siemens and Samsung Foundry strengthen collaboration to advance silicon design enablement (Monday, June 1, 2026)
• AMD Announces Production Ramp of Next-Generation AMD EPYC Processor "Venice" on TSMC 2nm Process Technology (Monday, May 25, 2026)
• United Microelectronics: The Market Is No Longer Pricing It As A Sleepy Mature-Node Foundry (Monday, May 25, 2026)
• Intel Accelerates 1.4nm Foundry Push, Targets Mass Production in 2029 (Monday, May 25, 2026)
• Samsung Electronics Revises GaN Semiconductor Strategy, Shifts Focus to Foundry (Monday, May 25, 2026)
• GlobalFoundries advances long-term technology innovation through investment in Playground Global (Thursday, May 21, 2026)
• Fraunhofer IPMS, APECS and FMD: High-density chiplet systems realized at wafer level (Thursday, May 21, 2026)
• IC-Link by imec joins TSMC 3DFabric® Alliance to accelerate advanced packaging and 3D IC innovation (Monday, May 18, 2026)
• UMC Announces Release of 14nm eHV FinFET Platform, Advancing Innovation in Next-Generation Smartphone Displays (Monday, May 18, 2026)
• Apple-Intel Foundry Deal Could Reshape U.S. Chip Manufacturing (Thursday, May 14, 2026)
• GlobalFoundries Outlines Long-Term Growth Roadmap and Announces First-Ever Dividend at 2026 Investor Day (Monday, May 11, 2026)
• Sony Semiconductor Solutions and TSMC Enter Preliminary Agreement for Next-Generation Image Sensor Strategic Partnership (Monday, May 11, 2026)
• SEMI ESD Alliance 2026 Executive Outlook Explores How Agentic AI Will Change Chip Design and Verification (Thursday, May 7, 2026)
• GlobalFoundries accelerates adoption of co-packaged optics for advanced AI data centers with SCALE optical module solution (Thursday, May 7, 2026)
• Apple Considers Samsung and Intel Foundries to Reduce Reliance on TSMC (Thursday, May 7, 2026)
• TSMC pushes next-gen chip expansion while Samsung grapples with union (Thursday, May 7, 2026)
• TSMC SoIC roadmap targets 2029 chip stacking (Monday, May 4, 2026)
• TSMC Latest Roadmap: A12, A13 for 2029 Without High-NA EUV; A16 Volume Production Delayed to 2027 (Monday, April 27, 2026)
• Cadence Collaborates with TSMC to Accelerate Design of Next-Generation AI Silicon (Thursday, April 23, 2026)