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• Cadence Collaborates with TSMC to Accelerate Design of Next-Generation AI Silicon (Thursday, April 23, 2026)
• Siemens collaborates with TSMC to advance AI for semiconductor design (Thursday, April 23, 2026)
• Synopsys Partners with TSMC to Power Next-Generation AI Systems with Silicon Proven IP and Certified EDA Flows (Thursday, April 23, 2026)
• TSMC Debuts A13 Technology at 2026 North America Technology Symposium (Thursday, April 23, 2026)
• TSMC Tightens 2nm Grip While Samsung Foundry Targets the Alternative Demand (Monday, April 20, 2026)
• Three Foundry Companies and the "Everyone’s Challenge Fabless" Initiative… Full-Scale Support for Startups (Thursday, April 16, 2026)
• Rapidus Opens Analysis Center and Rapidus Chiplet Solutions (Monday, April 13, 2026)
• Japan's Rapidus ramps up 2nm chip plans while eyeing factories on the Moon (Thursday, April 9, 2026)
• Japan’s Rapidus Races TSMC and Samsung in 1nm Chip Foundry (Monday, April 6, 2026)
• QuickLogic Announces Contract for High Density eFPGA Hard IP Optimized for Intel 18A (Thursday, April 2, 2026)
• Silicon Photonics Race Intensifies as TSMC Targets 2026 COUPE Production, Samsung Eyes 2029 CPO Turnkey (Thursday, April 2, 2026)
• Samsung Electronics Launches Silicon Photonics Foundry Business (Thursday, April 2, 2026)
• CEA-Leti and Fraunhofer IPMS Validate Wafer Exchange for Ferroelectric Memory Materials Within the FAMES Pilot Line (Thursday, March 26, 2026)
• IBM, Lam Research Focus High-NA EUV on Sub-1-nm Nodes (Monday, March 16, 2026)
• Samsung Applies 2nm Process to HBM Memory (Thursday, March 12, 2026)
• Global 2nm Supply Crunch: TSMC Leads as Intel 18A, Samsung, and Rapidus (Monday, March 9, 2026)
• Rapidus to Make Chips for Canon, Synopsys on Trial (Monday, March 9, 2026)
• Intel CEO embraces its 18A node for external customers as 18A-P gets 'inbound interest' — company cites increasing yields (Monday, March 9, 2026)
• ASML announces breakthrough in EUV light source to boost chip output (Monday, March 2, 2026)
• Moon Photonics: moving towards large-scale quantum photonics (Thursday, February 26, 2026)
• Europe’s stealth leading-edge process technology (Thursday, February 26, 2026)
• GlobalFoundries and Renesas Expand Partnership to Accelerate U.S. Semiconductor Manufacturing (Thursday, February 19, 2026)
• Samsung foundry steps up push to chase TSMC with 2 nm expansion and 1.4 nm plan (Thursday, February 19, 2026)
• TSMC scaling back 8‑inch production as advanced node demand surges (Thursday, February 19, 2026)
• GF partners with Telsys to expand Israel presence (Monday, February 9, 2026)
• TSMC to make advanced 3nm chips in Japan (Monday, February 9, 2026)
• Semiconductor Fabs Announce New Plans to Rebalance Capacity and Control (Thursday, February 5, 2026)
• IBM, Synopsys Move Toward 1.4-nm Node with Heat-Modeling Tech (Thursday, February 5, 2026)
• Samsung Foundry Reportedly Expects 30%+ 2nm Order Growth in 2026; 1.4nm Set for 2029 (Monday, February 2, 2026)
• NVIDIA Looks to Intel’s 18A/14A Process and EMIB Packaging for Next-Gen Feynman AI Chips, Signaling a Major Foundry Shift Beyond TSMC (Thursday, January 29, 2026)
• TSMC to Cut Fab14 Mature-Node Capacity by 15%-20% to Reflect Changing Demand Mix (Monday, January 26, 2026)
• Samsung Reportedly Moves Custom HBM Logic Die to 2nm Foundry Process for the First Time (Thursday, January 22, 2026)
• Why Quobly, STMicro, Soitec See Quantum as a Manufacturing Challenge (Thursday, January 22, 2026)
• Samsung perfecting 2nm Exynos 2600 yields, TSMC eyes 1.6nm in 2026 (Monday, January 19, 2026)
• Samsung to close down one of its 8-inch foundry fabs within the year (Monday, January 19, 2026)
• Samsung Electronics Gets Green Light in Foundry Business (Monday, January 12, 2026)
• TSMC to Lead Rivals at 2-nm Node, Analysts Say (Monday, January 12, 2026)
• AMD, NVIDIA and Others Reportedly to Debut New Chips at CES 2026, Spotlighting TSMC 3nm and 5nm (Thursday, January 8, 2026)
• CES 2026: Intel Core Ultra Series 3 Debut as First Built on Intel 18A (Thursday, January 8, 2026)
• TSMC's 2nm chips: The results are out. (Thursday, January 8, 2026)
• Japan’s Rapidus set to rival TSMC and Samsung for chip supremacy (Monday, January 5, 2026)
• Samsung Emerges as Potential Second Foundry for NVIDIA Alongside TSMC After Groq Licensing Deal (Monday, January 5, 2026)
• TSMC begins quietly volume production of 2nm-class chips — first GAA transistor for TSMC claims up to 15% improvement at ISO power (Monday, January 5, 2026)
• Samsung Set to Benefit from TSMC's 'N-2' Rule as AMD, Google Eye U.S. 2nm Production (Tuesday, December 23, 2025)
• onsemi to Develop Next-Generation GaN Power Devices with GlobalFoundries (Thursday, December 18, 2025)
• Significant 8 nm Order at Samsung Foundry Linked to Futuristic Intel 900-series Chipset (Thursday, December 18, 2025)
• Chinese SMIC Achieves 5 nm Production on N+3 Node Without EUV Tools (Thursday, December 18, 2025)
• Intel Installs ASML TWINSCAN EXE:5200B High-NA EUV Machine for 14A Node (Thursday, December 18, 2025)
• Samsung nears 2nm foundry deal with AMD as it closes gap with TSMC (Thursday, December 18, 2025)
• Rapidus unveils new AI design tools for advanced semiconductor manufacturing (Wednesday, December 17, 2025)