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• Socionext Broadens SoC Roadmap with Intel 18A-P Process Technology (Thursday, August 20, 2026)
• The changing role of the foundry (Thursday, August 20, 2026)
• TSMC Doubles Advanced Packaging Capacity Over Three Years, Samsung Goes All-In on 2nm Mass Production (Monday, August 17, 2026)
• Intel 14A Design Ecosystem Gains Support from Major EDA Partners (Monday, August 17, 2026)
• Samsung Foundry updates process roadmap to move 1.4nm node to 2029 — high-NA EUV will enable 1nm-class and smaller nodes in 2030 and beyond (Monday, August 17, 2026)
• Movellus Brings Power Optimization IP to Samsung Electronics’ Advanced Nodes (Thursday, August 13, 2026)
• Samsung Delays High-NA EUV Adoption Until 2030 for 1 nm Node (Thursday, August 13, 2026)
• Sony Semiconductor Solutions and TSMC Agreed to Establish Joint Venture for Next-Generation Image Sensors (Thursday, August 13, 2026)
• Cadence certifies AI-driven reference flows for Intel 18A-P and Intel 14A (Monday, August 10, 2026)
• Samsung Foundry's 4nm production fully booked through next year (Monday, August 10, 2026)
• TSMC Accelerates 3nm Output Months Early; 1.4nm Factory Beats Schedule (Monday, August 10, 2026)
• Samsung foundry targets full capacity utilization in second half of 2026 (Thursday, August 6, 2026)
• TSMC Moves Up 1.4nm Mass Production to 2028, Intensifying Rivalry With Samsung (Monday, August 3, 2026)
• Keysight Certifies Electromagnetic Design Software for Intel Foundry’s Latest Processes (Thursday, July 30, 2026)
• Siemens’ IC design solutions now certified for Intel 14A and Intel 18A-P process technologies (Thursday, July 30, 2026)
• GlobalFoundries signs letter of intent with the U.S. Department of Commerce for a $300 million award to accelerate U.S. silicon photonics leadership (Thursday, July 30, 2026)
• UMC Announces Fab Expansion in Singapore and Construction of New Fab in Tainan to Meet Accelerating AI Demand (Thursday, July 30, 2026)
• Intel and Lens Technology Collaborate to Enable Advanced Semiconductor Packaging for the AI Era (Monday, July 27, 2026)
• Samsung Electronics and Broadcom Expand Strategic Collaboration Across Memory and Foundry Technologies (Monday, July 27, 2026)
• SemiAnalysis teardown shows SMIC's N+3 node matches Intel's 18A in metal pitch (Thursday, July 23, 2026)
• Samsung Foundry completes tape-out of Tesla’s next-gen AI chip (Thursday, July 23, 2026)
• Samsung Foundry completes tape-out of Tesla’s next-gen AI chip (Monday, July 20, 2026)
• Rapidus and Cadence Partner on Agentic AI for Advanced SoC Design (Monday, July 20, 2026)
• SILITH and UMC Achieve Mass Production Milestone for Silicon Photonics (Thursday, July 16, 2026)
• Intel Resolves 18A Yield Variability; A Storm to Engulf Samsung and TSMC? (Thursday, July 16, 2026)
• Tesla-Samsung AI5 Chip Hits Tape-Out at Taylor Fab on 2nm Process (Monday, July 13, 2026)
• Rapidus to match TSMC on 2-nanometer chip pricing, Japan firm’s president says (Monday, July 13, 2026)
• MOSIS 2.0 and GlobalFoundries Partnership: A Strategic Alliance for Semiconductor Innovation (Thursday, July 9, 2026)
• Rapidus Pursues 2-nanometer Semiconductor Production in Japan (Thursday, July 9, 2026)
• TSMC Highlights 2nm and Advanced Packaging Progress (Thursday, July 9, 2026)
• US Media: Samsung and Anthropic Discuss Collaboration on 2nm AI Chips and Advanced Packaging (Monday, July 6, 2026)
• Samsung Reaffirms 1.4nm Chips for 2029 and Adds an Enhanced SF1.4+ Node (Monday, July 6, 2026)
• Samsung Unveils AI Foundry Ecosystem Push (Thursday, July 2, 2026)
• Samsung resumes 1.4nm chip development, targets 2029 mass production (Thursday, July 2, 2026)
• IBM Unveils Sub-1nm Chip Tech with 50% Performance Boost (Monday, June 29, 2026)
• Global Foundry 2.0 Revenue Rises 23% YoY in Q1 2026 as AI Continues to Boost Demand (Monday, June 29, 2026)
• TSMC (NYSE:TSM) Is Raising 7nm Chip Prices Up To 10% As Expansion Builds (Monday, June 29, 2026)
• Advanced USB Connectivity IP Validated on N2P Process Technology (Monday, June 29, 2026)
• GlobalFoundries qualifies SLATE™ advanced packaging technology on 9SW platform for next-generation radio frequency applications (Thursday, June 25, 2026)
• Samsung Foundry Reportedly in Talks with AMD for 2028 CPU Production as BYD, Google Consider Its Services (Monday, June 22, 2026)
• Report: Intel Partners With Taiwan’s UMC on 3nm Chips, Taking Direct Aim at TSMC’s Foundry Dominance (Monday, June 22, 2026)
• Rapidus Signs MoU with Fondazione Chips-IT in Italy for Future Semiconductor ManufacturingNew collaboration provides framework between the Japan government and Italy (Monday, June 22, 2026)
• UK Semiconductor Centre and Rapidus partner to expand access to advanced chip technologies (Thursday, June 18, 2026)
• Intel Foundry Details Process Milestones and Future Innovation at VLSI Symposium (Thursday, June 18, 2026)
• ASML, TSMC and imec bring industry-ready 2D-material transistors closer with breakthrough 300mm integration (Thursday, June 18, 2026)
• Strong AI Demand and Early Consumer Electronics Inventory Build Drive Top 10 Foundries to 3.7% QoQ Revenue Growth in 1Q26 (Monday, June 15, 2026)
• CEA‑Leti Advances European FD-SOI Innovation with GlobalFoundries’ Collaboration in the FAMES Pilot Line (Monday, June 15, 2026)
• Samsung and Nvidia Partnership Upgrade: HBM4E, HBM5 and Autonomous Driving Chip Foundry Enter Substantial Discussions (Monday, June 15, 2026)
• Samsung Says Nvidia Partnership Extends Beyond HBM to Foundry Collaboration (Thursday, June 11, 2026)
• Cadence Announces Collaboration with Intel Foundry to Accelerate Intel 14A Process Optimization for HPC and Mobile Designs (Wednesday, June 10, 2026)