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• Metalenz and UMC Bring Breakthrough Face Authentication Solution Polar ID to Mass Production (Thursday, November 13, 2025)
• TSMC Board of Directors Meeting Resolutions (Thursday, November 13, 2025)
• How Advanced Packaging is Unleashing Possibilities for Edge AI (Thursday, November 13, 2025)
• GlobalFoundries Licenses GaN Technology from TSMC to Accelerate U.S.-Manufactured Power Portfolio for Datacenter, Industrial and Automotive Customers (Thursday, November 13, 2025)
• Day 2 of PIC Summit: Photonic Chip Applications Taking Centre Stage (Monday, November 10, 2025)
• High Tech Campus Eindhoven Invests in, and Constructs Building and Cleanroom Facilities for TNO’s 6-inch Photonic Chip Pilot Line (Monday, November 10, 2025)
• TSMC Reportedly Plans 12 New Advanced Process and Packaging Fabs in Taiwan as 2nm Supply Tightens (Monday, November 10, 2025)
• TSMC’s 3nm Process Has Entered ‘Golden Period Of Mass Production,’ Estimates State That Monthly Wafer Production Can Reach 160,000 Units By The End Of 2025 (Monday, November 10, 2025)
• TSMC October 2025 Revenue Report (Monday, November 10, 2025)
• Europe Must Play to Its Strengths (Thursday, November 6, 2025)
• Samsung’s Taylor Plant In Texas About To Commence Operations, New Report Says ASML Will Form A Team Soon To Set Up EUV Machinery And Ease Production Transition (Thursday, November 6, 2025)
• TSMC A14 fab construction approved, set to start soon: Science park (Monday, November 3, 2025)
• GlobalFoundries and Silicon Labs Expand Partnership to Accelerate Wireless Connectivity Solutions and Strengthen U.S. Chip Manufacturing (Monday, November 3, 2025)
• GlobalFoundries Plans Billion-Euro Investment to Expand Chip Manufacturing in Germany (Thursday, October 30, 2025)
• Advanced Deposition Chemistry for Sub-2nm Chips (Monday, October 27, 2025)
• Cambridge GaN Devices partners with GlobalFoundries for advanced power devices (Monday, October 27, 2025)
• UMC Introduces 55nm BCD Platform to Elevate Power Efficiency for Smartphones, Consumer Electronics, and Automotive Applications (Monday, October 27, 2025)
• Intel's 18A Process Challenges TSMC, Samsung Foundry (Monday, October 27, 2025)
• SOI Technology: Powering the Next Wave of AI and Advanced Computing with Unprecedented Efficiency (Friday, October 24, 2025)
• TSMC Reportedly Doubles Lithography Patents From 2016 to 2023, Extending Lead Over Rivals (Thursday, October 23, 2025)
• Intel Foundry Reportedly Secures 18A Order from Microsoft for Maia 3 Accelerator (Monday, October 20, 2025)
• NVIDIA partners with TSMC, and the first wafer of the Blackwell chips manufactured in the United States is unveiled. (Monday, October 20, 2025)
• Intel's 18A production starts before TSMC’s competing N2 tech — here's how the two process nodes compare (Thursday, October 16, 2025)
• Samsung to buy ASML's most advanced lithography tools to rival TSMC (Thursday, October 16, 2025)
• Foundry Market Set to Grow as AI and Advanced Packaging Drive Demand (Thursday, October 16, 2025)
• Analog Bits Awarded TSMC's 2025 OIP Partner of the Year Award (Monday, October 6, 2025)
• Keller says Intel needs to fix its foundry game (Monday, October 6, 2025)
• Intel Allegedly in Talks with AMD for Potential Foundry Manufacturing Deal (Monday, October 6, 2025)
• Rapidus Reportedly Flags U.S. Firms as Potential Customers, IBM and Tenstorrent Lead the Pack (Monday, October 6, 2025)
• TSMC Price Hikes End the Era of Cheap Transistors (Wednesday, October 1, 2025)
• GlobalFoundries and Corning Collaborate To Deliver Detachable Fiber Connector Solutions to Scale Next-Generation Optical Connectivity (Monday, September 29, 2025)
• AI and Chiplets Prominent at TSMC OIP 2025 (Friday, September 26, 2025)
• proteanTecs Announces Silicon-Proven IP on TSMC's Advanced N2P Process (Thursday, September 25, 2025)
• GlobalFoundries and Egis Partner to Develop Next-Generation Smart Sensing Technology for Mobile and IoT Applications (Wednesday, September 24, 2025)
• Silicon Creations Announces 1000th Production FinFET Tapeout at TSMC and Immediate Availability of Full IP Library on TSMC N2 Technology (Thursday, September 18, 2025)
• Sofics joins GlobalFoundries' GlobalSolutions Ecosystem to Enhance Chip Robustness, Performance and Design Efficiency (Thursday, September 18, 2025)
• TSMC's SiC Substrate Strategy: Scaling Thermal Performance for AI and 3D Packaging (Wednesday, September 17, 2025)
• MediaTek's First Chipset Using TSMC's 2nm Process Expected in Late 2026 (Tuesday, September 16, 2025)
• TSMC's first 2 nm Node Customers are Apple, AMD, NVIDIA, and MediaTek; Intel Missing (Tuesday, September 16, 2025)
• Intel Announces Key Leadership Appointments to Accelerate Innovation and Strengthen Execution (Monday, September 15, 2025)
• From Foundry to Forum: Taiwan's Repositioning in the New Semiconductor Order (Monday, September 15, 2025)
• Silicon Photonics in the Spotlight: TSMC Lifts the Curtain on COUPE at SEMICON Taiwan (Monday, September 15, 2025)
• TSMC Moves to Lead in "Silicon Photonics"... More Than Twice as Many Patent Applications as Intel (Monday, September 15, 2025)
• Intel 14A node confirmed more expensive than 18A due to High-NA EUV (Wednesday, September 10, 2025)
• Rapidus 2HP 2 nm Node to Match TSMC N2 on Logic Density (Monday, September 1, 2025)
• Rapidus 2HP Reportedly Surpasses Intel 18A Logic Density Impacted by BSPDN, Rivals TSMC (Monday, September 1, 2025)
• TSMC's first 1.4nm chip facility ahead of schedule, initial investment could be close to $50B (Thursday, August 28, 2025)
• Industry’s first high-performance complementary BiCMOS technology delivers performance and power advantages for essential markets and applications (Thursday, August 28, 2025)
• Rapidus Announces Strategic Collaboration with Keysight To Improve Yield and Achieve High-Precision PDK For 2nm GAA Semiconductors (Tuesday, August 26, 2025)
• GlobalFoundries Champions 'Essential Technologies' over Moore's Law (Monday, August 25, 2025)