Jun. 09, 2025 –
Palo Alto, CA – June 4, 2025 – Sarcina Technology, a specialist in semiconductor and photonic package design, has announced advances in its photonic package design capabilities for Co-Packaged Optics (CPO), which address fundamental challenges facing data centers about how to deal with the rapidly increasing amount of data as AI evolves. Sarcina’s pioneering work in photonic package design is enabling a new era of high data rate, high bandwidth and low power interconnects.
Traditional copper interconnects can no longer meet the performance, power and density demands of next generation data center systems. Copper interconnects become inadequate when the signal traveling distance is longer than a few meters, due to excessive insertion loss of a copper cable. System architects are now moving towards optical integration at the package level because of higher bandwidth, lower latency, energy-efficiency, space-saving and longer transmission distances.
According to Larry Zu, CEO at Sarcina Technology: “Our new approach to Co-Packaged Optics removes the long copper trace between the switch and the optical module, replacing it with short, high-integrity connections between ASIC and optics. This is made possible because of our unique package design skills, creating novel layout architectures and integration schemes that directly integrate switch ASICs to photonic ICs inside a package. As the recent rise in AI applications puts more and more pressure on data center systems, the need for this expertise has never been greater.”
Sarcina’s design approach is rooted in four key disciplines: electrical performance, optical alignment, thermal control and mechanical robustness. Its packaging solutions are carefully architected to achieve:
Sarcina’s design portfolio includes full-package architecture for integrating photonic and electronic components in a single module:
Larry Zu concludes: “Sarcina's expertise in both high-speed electrical packaging and Co-Packaged Optics with Silicon Photonics chiplets sets us apart. This is particularly valuable as the industry shifts toward co-packaged solutions to improve data transmission efficiency and reduce power consumption. By seamlessly integrating multiple ASIC dice with optical components, Sarcina addresses challenges facing data centers that traditional semiconductor or optical companies might struggle with. It’s exciting to see how this kind of cross-disciplinary capability can shape next-generation connectivity and computing solutions.”
Sarcina Technology is a leading specialist in semiconductor and photonic package design solutions. Headquartered in Palo Alto, California, with a design and supply chain management office in Taipei, Sarcina specializes in package design, power/signal integrity analysis and thermal simulation. Its comprehensive services include wafer probing, final test hardware design, test program development and device/package qualification. Renowned for its innovation, reliability and proven results, Sarcina delivers high-quality solutions to customers worldwide. For more company information please visit our website: www.sarcinatech.com