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Chiplet / Multi-Die News

• Rambus Delivers Industry-Leading Client Chipsets for Next-Generation AI PC Memory Modules (Wednesday, May 14, 2025)
• Arteris Wins Two Gold and One Silver Stevie® Awards in the 2025 American Business Awards® (Friday, April 25, 2025)
• Arteris Wins Two Gold and One Silver Stevie® Awards in the 2025 American Business Awards® (Friday, April 25, 2025)
• Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results (Tuesday, February 18, 2025)
• Why UCIe is Key to Connectivity for Next-Gen AI Chiplets (Wednesday, February 5, 2025)
• Mirabilis Design Adds System-Level Modelling Support for Industry-Standard Arteris FlexNoC and Ncore Network-on-Chip IPs (Tuesday, February 4, 2025)
• Predictions for Multi-Die System Designs in 2025 (Monday, February 3, 2025)
• Synopsys makes a bold prediction (Wednesday, January 29, 2025)
• Chiplet Summit 2025 Nods to a Bright Future for Disaggregated Computing (Thursday, January 23, 2025)
• SoC design: What's next for NoCs? (Thursday, January 23, 2025)
• Arm Chiplet System Architecture Makes New Strides in Accelerating the Evolution of Silicon (Tuesday, January 21, 2025)
• YorChip announces patent-pending Universal PHY for Open Chiplets (Monday, January 20, 2025)
• Credo to Exhibit at Chiplet Summit 2025 (Monday, January 20, 2025)
• Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit (Monday, January 20, 2025)
• Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X (Monday, January 20, 2025)
• YorChip announces patent-pending Universal PHY for Open Chiplets (Monday, January 20, 2025)
• Credo to Exhibit at Chiplet Summit 2025 (Monday, January 20, 2025)
• Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit (Monday, January 20, 2025)
• Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X (Monday, January 20, 2025)
• QuickLogic to Exhibit at Chiplet Summit 2025 (Thursday, January 16, 2025)
• QuickLogic to Exhibit at Chiplet Summit 2025 (Thursday, January 16, 2025)
• InPsytech Announces Finalization of UCIe IP Design, Driving Breakthroughs in High-Speed Transmission Technology (Wednesday, January 15, 2025)
• InPsytech Announces Finalization of UCIe IP Design, Driving Breakthroughs in High-Speed Transmission Technology (Wednesday, January 15, 2025)
• InPsytech Announces Finalization of UCIe IP Design, Driving Breakthroughs in High-Speed Transmission Technology (Wednesday, January 15, 2025)
• Fraunhofer IZM is powering the evolution of chiplet technologies as part of the APECS pilot line (Tuesday, January 14, 2025)
• Fraunhofer IZM is powering the evolution of chiplet technologies as part of the APECS pilot line (Tuesday, January 14, 2025)
• YorChip and ChipCraft announce low-cost, high-speed 200Ms/s ADC Chiplet (Monday, January 13, 2025)
• Chip Interfaces Successfully Completes Interlaken IP Interoperability Test with Cadence 112G Long-Reach PHY (Monday, January 13, 2025)
• YorChip and ChipCraft announce low-cost, high-speed 200Ms/s ADC Chiplet (Monday, January 13, 2025)
• Chip Interfaces Successfully Completes Interlaken IP Interoperability Test with Cadence 112G Long-Reach PHY (Monday, January 13, 2025)
• MZ Technologies Unveils Next Generation Chiplet/Package Design Tool (Monday, January 13, 2025)
• YorChip and ChipCraft announce low-cost, high-speed 200Ms/s ADC Chiplet (Monday, January 13, 2025)
• Chip Interfaces Successfully Completes Interlaken IP Interoperability Test with Cadence 112G Long-Reach PHY (Monday, January 13, 2025)
• MZ Technologies Unveils Next Generation Chiplet/Package Design Tool (Monday, January 13, 2025)
• YorChip and ChipCraft announce low-cost, high-speed 200Ms/s ADC Chiplet (Monday, January 13, 2025)
• Chip Interfaces Successfully Completes Interlaken IP Interoperability Test with Cadence 112G Long-Reach PHY (Monday, January 13, 2025)
• MZ Technologies Unveils Next Generation Chiplet/Package Design Tool (Monday, January 13, 2025)
• Multi-Die Health and Reliability: Synopsys and TSMC Showcase UCIe Advances (Wednesday, January 8, 2025)
• GUC Taped Out UCIe 40Gbps IP using Adaptive Voltage Scaling (AVS) (Monday, January 6, 2025)
• 64Gbps Universal chiplet boosts interconnect data rates (Sunday, December 29, 2024)
• Gen3 UCIe IP elevates chiplet link speeds (Wednesday, December 25, 2024)
• Everything Goes Up! Top Trends of 2024 (Sunday, December 22, 2024)
• Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity (Thursday, December 19, 2024)
• Cadence Rolls Out System Chiplet to Reorganize the SoC (Tuesday, December 17, 2024)
• Chiplet Summit Features the Latest Chip Design Technology (Monday, December 16, 2024)
• Fraunhofer IAF expands technology capabilities for chiplet innovations within the APECS pilot line (Monday, December 16, 2024)
• European chiplet pilot line starts operations (Monday, December 16, 2024)
• Democratizing Chiplets (Tuesday, December 10, 2024)
• YorChip and Digitho developing breakthrough 2D Chiplet Packaging for Mass Markets (Wednesday, December 4, 2024)
• IP players prominent in chiplet's 2024 diary (Sunday, December 1, 2024)