Jul. 14, 2025 –
T2M-IP proudly announces that a Tier-1 U.S.-based customer has licensed its Interface and Analog IP Cores for next-generation AR/VR chipsets for integration into their upcoming line of high-performance, ultra-light AR/VR smart glasses.
The engagement covers an end-to-end suite of processing, AI, display, sensor, memory, interface, and Analog IP cores — engineered to enable immersive, low-latency, and power-efficient spatial experiences.
Highlight on USB and MIPI IPs Cores
USB 3.1 Gen 2 PHY & Controller IP Cores
MIPI CSI-2 & DSI-2 PHY & Controller IP Cores
These USB and MIPI interfaces are the digital arteries of the AR/VR system. They ensure high-speed, real-time connectivity between compute, vision, and display — all under tight power budgets.”
Analog IP Subsystem — The Sensory Backbone of Immersive Silicon
As AR/VR systems become increasingly reliant on real-world inputs and precision audio, the licensed IP set includes a robust Analog Subsystem that supports essential physical interfacing.
ADC IP (Analog-to-Digital Converter)
DAC IP (Digital-to-Analog Converter)
Additional Analog IP Blocks:
“Analog IP isn’t just supporting logic — it’s the real-world connective tissue for immersive experiences. “With precision ADC/DAC and robust analog signal handling, our platform brings XR hardware one step closer to biological realism.”
Customer Vision
The Tier-1 customer plans to deploy this IP suite in a new generation of AR/VR headsets targeting:
Tape-out is expected later this year with first customer samples in early 2026.
About T2M: T2M-IP is a global independent semiconductor technology expert, supplying complex semiconductor IP Cores, Software, KGD, and disruptive technologies to allow faster development of your Wearables, IOT, Automotives, Communications, Storage, Servers, Networking, TV, STB, and Satellite SoCs. For more information, please visit www.t-2-m.com or mail us on contact@t-2-m.com