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• Soitec and NSIG to agree extension of licensing framework (Monday, March 16, 2026)
• CEA-Leti and NcodiN Partner to Industrialize 300 mm Silicon Photonics for Bandwidth-Hungry AI Interconnects (Thursday, March 12, 2026)
• Axelera Raises $250M in Largest EU Semi Round Ever (Monday, March 9, 2026)
• Nvidia and Lumentum form $2bn AI optics partnership (Monday, March 9, 2026)
• STMicroelectronics enters high-volume production of its industry-leading silicon photonics platform to support AI infrastructure demand (Monday, March 9, 2026)
• Keysight Demonstrates 5G-Advanced AI-Powered Channel State Information Compression and Paves the Way for 6G (Monday, March 9, 2026)
• ST technologies integrated into Qualcomm’s new Snapdragon Wear Elite platform (Thursday, March 5, 2026)
• Keysight and Qualcomm Advance RF Digital Twins to Scale Massive MIMO and AI-Native 6G Research (Thursday, March 5, 2026)
• Samsung Ships Industry-First Commercial HBM4 With Ultimate Performance for AI Computing (Thursday, March 5, 2026)
• EU backs €1.1bn French cleantech manufacturing push (Wednesday, March 4, 2026)
• STMicroelectronics’ new STM32 series redefines entry-level microcontroller performance and value for smart devices everywhere (Wednesday, March 4, 2026)
• DCD-SEMI to Showcase CAN XL with Functional Safety and RISC-V Subsystems at Embedded World 2026 – Booth 4-481 (Tuesday, March 3, 2026)
• MWC: Ericsson and Intel join for 6G AI-RAN (Monday, March 2, 2026)
• Keysight to Demonstrate AI-Driven Wireless Innovations and 6G Readiness at Mobile World Congress 2026 (Friday, February 27, 2026)
• Embedded FPGA reaches a new stage of industrial maturity – Menta at Embedded World 2026 (Thursday, February 26, 2026)
• SEALSQ Prioritizes Silicon-Based Quantum Computing to Align with Semiconductor Technology (Thursday, February 26, 2026)
• MIPI Alliance Releases UniPro v3.0 and M-PHY v6.0, Accelerating JEDEC UFS Performance for Edge AI in Mobile, PC and Automotive (Thursday, February 26, 2026)
• MIPI Alliance Releases UniPro v3.0 and M-PHY v6.0, Accelerating JEDEC UFS Performance for Edge AI in Mobile, PC and Automotive (Tuesday, February 24, 2026)
• Europractice 2.0 secures EU funding until September 2028 (Sunday, February 22, 2026)
• Europe Doubles Down on Semiconductor Strengths (Sunday, February 22, 2026)
• Funding must be activated for semiconductor success (Sunday, February 22, 2026)
• Ceva to Participate in Upcoming Investor Conferences and Industry Events (Sunday, February 22, 2026)
• EnSilica to sponsor Tiny Tapeout workshop at the University of Sheffield (Sunday, February 22, 2026)
• CEA Demonstrates First Dynamically Routed Electro-Optical Router for Photonic Interposers (Thursday, February 19, 2026)
• Keysight Introduces PAM3 Signaling with New GDDR7 Transmitter Compliance Solution for Next-Generation Graphics Memory (Thursday, February 19, 2026)
• Keysight Introduces PAM3 Signaling with New GDDR7 Transmitter Compliance Solution for Next-Generation Graphics Memory (Wednesday, February 18, 2026)
• EnSilica to highlight turnkey ASIC expertise and European supply resilience at embedded world 2026 (Monday, February 16, 2026)
• CEA and Soitec launch their collaborative area (Friday, February 13, 2026)
• Synopsys to showcase AI-driven engineering innovation at India AI Impact Summit 2026 (Friday, February 13, 2026)
• EU launches NanoIC pilot line to oversee development of sub-2nm chips on the continent (Thursday, February 12, 2026)
• Tower Semiconductor & Nvidia team up on 1.6T silicon photonics for AI data centers (Monday, February 9, 2026)
• Synopsys Lightmatter Alliance Highlights Bet On AI Chip Connectivity IP (Monday, February 9, 2026)
• Lam Research and CEA-Leti Expand Research and Development Collaboration to Advance Fabrication of Specialty Technologies (Thursday, February 5, 2026)
• UK-Bulgaria partnership set to boost semiconductor innovation (Wednesday, February 4, 2026)
• Dassault Systèmes and NVIDIA Partner to Build Industrial AI Platform Powering Virtual Twins (Wednesday, February 4, 2026)
• Europe’s leadership in photonic chips under threat (Thursday, January 29, 2026)
• Lightmatter and Cadence Collaborate to Accelerate Optical Interconnect for AI Infrastructure (Thursday, January 29, 2026)
• Veeco and imec develop 300mm compatible process to enable integration of barium titanate on silicon photonics (Thursday, January 29, 2026)
• NanoXplore and STMicroelectronics deliver European FPGA for space missions (Thursday, January 29, 2026)
• MosChip Completes 28-nm SoC for India’s Space Center (Thursday, January 29, 2026)
• DCD-SEMI to Exhibit at SEMICON Korea 2026 with EU Mission Hub (Monday, January 26, 2026)
• Vietnam breaks ground on first semiconductor chip plant in Hanoi (Thursday, January 22, 2026)
• Synopsys Announces New Converge Conference, March 11-12, to Drive Intelligent Systems Innovation (Thursday, January 22, 2026)
• CEA-Leti Demonstrates Combined MicroLED and Organic Photodetector Architecture For Display-Integrated Optical Sensing (Thursday, January 22, 2026)
• CEA-Leti Advances Silicon-Integrated Quantum Cascade Lasers for Mid-Infrared Photonics (Thursday, January 22, 2026)
• Keysight Collaborates on Airbus UpNext SpaceRAN Demonstrator to Advance 5G NTN Innovation (Thursday, January 22, 2026)
• Why PICs Power Next-Gen Data Centers and Quantum-Safe Security (Monday, January 19, 2026)
• NVIDIA Includes Ethernet Photonics in New Six-Chip AI Rubin Platform (Monday, January 19, 2026)
• Processors for Smart Manufacturing (Monday, January 19, 2026)
• Breakthrough in silicon switches: Prof. Hua Wang’s IDEAS Group presents new class of high-frequency switches in "Nature Electronics" (Monday, January 19, 2026)