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• Europractice 2.0 secures EU funding until September 2028 (Sunday, February 22, 2026)
• Europe Doubles Down on Semiconductor Strengths (Sunday, February 22, 2026)
• Funding must be activated for semiconductor success (Sunday, February 22, 2026)
• Ceva to Participate in Upcoming Investor Conferences and Industry Events (Sunday, February 22, 2026)
• EnSilica to sponsor Tiny Tapeout workshop at the University of Sheffield (Sunday, February 22, 2026)
• CEA Demonstrates First Dynamically Routed Electro-Optical Router for Photonic Interposers (Thursday, February 19, 2026)
• Keysight Introduces PAM3 Signaling with New GDDR7 Transmitter Compliance Solution for Next-Generation Graphics Memory (Thursday, February 19, 2026)
• Keysight Introduces PAM3 Signaling with New GDDR7 Transmitter Compliance Solution for Next-Generation Graphics Memory (Wednesday, February 18, 2026)
• EnSilica to highlight turnkey ASIC expertise and European supply resilience at embedded world 2026 (Monday, February 16, 2026)
• CEA and Soitec launch their collaborative area (Friday, February 13, 2026)
• Synopsys to showcase AI-driven engineering innovation at India AI Impact Summit 2026 (Friday, February 13, 2026)
• EU launches NanoIC pilot line to oversee development of sub-2nm chips on the continent (Thursday, February 12, 2026)
• Tower Semiconductor & Nvidia team up on 1.6T silicon photonics for AI data centers (Monday, February 9, 2026)
• Synopsys Lightmatter Alliance Highlights Bet On AI Chip Connectivity IP (Monday, February 9, 2026)
• Lam Research and CEA-Leti Expand Research and Development Collaboration to Advance Fabrication of Specialty Technologies (Thursday, February 5, 2026)
• UK-Bulgaria partnership set to boost semiconductor innovation (Wednesday, February 4, 2026)
• Dassault Systèmes and NVIDIA Partner to Build Industrial AI Platform Powering Virtual Twins (Wednesday, February 4, 2026)
• Europe’s leadership in photonic chips under threat (Thursday, January 29, 2026)
• Lightmatter and Cadence Collaborate to Accelerate Optical Interconnect for AI Infrastructure (Thursday, January 29, 2026)
• Veeco and imec develop 300mm compatible process to enable integration of barium titanate on silicon photonics (Thursday, January 29, 2026)
• NanoXplore and STMicroelectronics deliver European FPGA for space missions (Thursday, January 29, 2026)
• MosChip Completes 28-nm SoC for India’s Space Center (Thursday, January 29, 2026)
• DCD-SEMI to Exhibit at SEMICON Korea 2026 with EU Mission Hub (Monday, January 26, 2026)
• Vietnam breaks ground on first semiconductor chip plant in Hanoi (Thursday, January 22, 2026)
• Synopsys Announces New Converge Conference, March 11-12, to Drive Intelligent Systems Innovation (Thursday, January 22, 2026)
• CEA-Leti Demonstrates Combined MicroLED and Organic Photodetector Architecture For Display-Integrated Optical Sensing (Thursday, January 22, 2026)
• CEA-Leti Advances Silicon-Integrated Quantum Cascade Lasers for Mid-Infrared Photonics (Thursday, January 22, 2026)
• Keysight Collaborates on Airbus UpNext SpaceRAN Demonstrator to Advance 5G NTN Innovation (Thursday, January 22, 2026)
• Why PICs Power Next-Gen Data Centers and Quantum-Safe Security (Monday, January 19, 2026)
• NVIDIA Includes Ethernet Photonics in New Six-Chip AI Rubin Platform (Monday, January 19, 2026)
• Processors for Smart Manufacturing (Monday, January 19, 2026)
• Breakthrough in silicon switches: Prof. Hua Wang’s IDEAS Group presents new class of high-frequency switches in "Nature Electronics" (Monday, January 19, 2026)
• Photonics Lights Up Canada’s Semiconductor Scene (Thursday, January 15, 2026)
• 6G standardisation moves closer as 2026 begins (Monday, January 12, 2026)
• Keysight Achieves Industry-Leading Live NR-NTN Connectivity in n252 S-Band, Including Satellite-to-Satellite Mobility, in Collaboration with Samsung (Monday, January 12, 2026)
• Energy-efficient RF power modules developed using SOI technology (Monday, January 12, 2026)
• CES 2026 Consumer Tech Trends: EMEA Will Lead Growth (Thursday, January 8, 2026)
• Siemens unveils mobile showroom experience at CES 2026, bringing the future of adaptive automation directly to industry (Thursday, January 8, 2026)
• GUC’s HBM4E IP Honored with Best IP / Processor and Five-Year Achievement in EE Awards Asia 2025 (Thursday, January 8, 2026)
• Canada Focuses Funding on Photonics and Quantum (Monday, January 5, 2026)
• Omni Design Technologies Appoints Hinesh Shah as Vice President of Strategic Sales (Friday, December 19, 2025)
• Joachim Kunkel Joins Quadric Board of Directors (Tuesday, December 16, 2025)
• Quadric Appoints Ravi Chakaravarthy VP SW Engineering (Monday, December 15, 2025)
• BOS Semiconductors @ AISFC 2025 (Monday, December 15, 2025)
• CEA-Leti & STMicroelectronics’ Paper at IEDM 2025 Demonstrates Path to Fully Monolithic Silicon RF Front-Ends with 3D Sequential Integration (Thursday, December 11, 2025)
• Silicon Photonics Momentum Builds: Samsung Ramps R&D in Singapore, UMC Teams With IMEC (Monday, December 8, 2025)
• First-ever quantum chip combining electronics and photonics made in commercial CMOS foundry (Monday, December 8, 2025)
• Nordic Semiconductor unveils nRF54LV10A - a breakthrough low-voltage Bluetooth LE SoC for next-gen healthcare wearables (Monday, December 8, 2025)
• Ceva-XC21 Named "Best IP/Processor of the Year" at EE Awards Asia (Monday, December 8, 2025)
• BOS Semiconductors at 2025 Korea Tech Festival (Thursday, December 4, 2025)