The scalability of mPower enables customers such as UMC to carry out more accurate analysis on larger layouts than ever before and the Transistor-Level Pre-Layout EM and IR Drop capabilities enable early detection of potential issues, allowing designers to optimize chip performance and enhance reliability.
After extensive evaluation, UMC successfully used mPower's automated processes to perform comprehensive SRAM full-chip circuit analysis, delivering precise IR drop distribution assessments and enabling early-stage risk detection.
"By integrating Siemens' mPower into our design verification flow, we're enhancing our ability to identify and address potential issues earlier in the development cycle," said Osbert Cheng, vice president of device technology development & design support, UMC. "This aligns perfectly with modern design requirements and helps ensure superior product quality for our customers." Key benefits gained with the implementation of mPower at UMC:
- Accelerated time-to-market through industry-leading scalability and rapid verification.
- Enhanced product reliability through early detection and resolution of potential issues.
- Seamless integration with existing design workflows, enabling comprehensive power analysis.
“Our work with UMC to successfully implement mPower at UMC marks a significant advancement in semiconductor design verification capabilities,” said Ankur Gupta, senior vice president and general manager of Digital Design Creation Platform, Siemens Digital Industries Software. “As the semiconductor industry addresses the ever-growing challenge of complexity, leaders and pioneers are looking to Siemens’ EDA portfolio to accelerate the design process and help them deliver capable, reliable products to market.”
To learn more about how Siemens’ mPower solutions deliver power integrity analysis for digital, analog and 3D IC across all design flows at any scale, visit https://eda.sw.siemens.com/en-US/ic/mpower/