Design & Reuse

Silicon Photonics in the Spotlight: TSMC Lifts the Curtain on COUPE at SEMICON Taiwan

Sept. 15, 2025 – 

By TrendForce (September 9, 2025)

As SEMICON Taiwan 2025 kicks off this week, the Silicon Photonics Global Summit took the spotlight on September 8, featuring senior executives from global chip giants such as TSMC, NVIDIA, and Broadcom sharing their latest progress. According to Commercial Times, K.C. Hsu, Vice President of Integrated Interconnect & Packaging at TSMC, called 2024 the “awakening year” for silicon photonics and forecast explosive demand growth in the years ahead as the technology matures.

Notably, TSMC Director Shih-Fen Huang highlighted the foundry giant’s COUPE (COmpact Universal Photonic Engine) at the Silicon Photonics Global Summit. According to TechNews, she stressed silicon photonics’ key edge—using wavelength division multiplexing (WDM) on a single optical fiber. Unlike electrical links that need extra wiring, optical interconnects can scale seamlessly across multiple dimensions, the report suggests.

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