Sept. 15, 2025 –
Yokohama, Japan and Langen/Frankfurt, Germany -- Socionext Inc. today announced the renewal of its cooperative research agreement for the Core Partner Program with imec, the world's largest independent research institute and innovation center in nanoelectronics and digital technologies. Through its participation in the Core Partner Program, Socionext has been promoting research activities in Design-Technology Co-Optimization and System- Technology Co-Optimization, for leading-edge logic semiconductor and 2.5D/3D leading-edge packaging. With the renewed agreement, Socionext will expand its activities in 3D advanced packaging technologies in order to obtain a wide range of knowledge on the reliability of chiplets, and further strengthen its research activities in chiplet demonstration design, for applications including automotive. Socionext will utilize these knowledge and technologies to deliver high-precision, high-quality leading-edge semiconductor products.
The advancements in various industries in recent years have been driven by the evolution of computing power capable of processing huge amounts of data instantaneously, and semiconductor technology at its core is also becoming increasingly advanced. Chiplets and 3D heterogeneous integration to flexibly respond to workload and application requirements, process technologies evolving to Angstrom nodes, as well as advanced logic semiconductor technologies to enable high-density mounting including backside wiring technologies by are all essential.
The design and development of devices utilizing these advanced technologies are required addressing thermal and mechanical strength issues, along with highly efficient design to reduce skyrocketing development and manufacturing costs.
Especially for automotive chiplets, consideration of physical mechanism as well as a deep understanding of manufacturing technology becomes important to ensure high reliability.
Through this enhanced collaboration with imec, Socionext will deepen its access to cutting-edge technologies and strengthen its ability to develop products that meet the needs of innovative customers in our focus areas, including advanced SoCs for automotive applications.