Sept. 02, 2025, Sept. 02, 2025 –
As more companies pursue ASICs to gain product-level differentiation, the ASIC road from concept to chip is paved with unseen challenges.
Many design teams, especially startups or system OEMs new to silicon, encounter the same pitfalls that delay projects, drain budgets, or derail product timelines.
Based on our experience at Key ASIC working with worldwide customers, here are the three hidden risks we see most often — and how to avoid them.
1. Underestimating Packaging and Test Complexity
While front-end design often gets the spotlight, packaging and testing are where reality hits. A poorly chosen package can cause signal integrity issues, thermal failures, or increased test costs. Early alignment between IC specs, packaging engineers, and end-application constraints is crucial.
Tip: Engage packaging and test planning as early as RTL freeze.
2. Overlooking Foundry & Tape-Out Logistics
Foundry access isn't guaranteed, especially for low-volume designs. Design teams often assume they can easily slot into a fab schedule, only to find that tape-out windows are limited or blocked. Plus, working across different EDA tools, PDKs, and process nodes adds another layer of complexity.
Tip: Work with a design partner that has established foundry relationships and can navigate multi-node, multi-foundry flexibility.
3. Incomplete Verification & Coverage Gaps
Even with fully functional verified RTL, insufficient simulation or constrained verification environments can miss bugs that possibly appear in silicon. Functional coverage metrics are useful, but so are real-world scenario checks, corner case tests, and formal methods.
Tip: Prioritize a rigorous verification plan—especially if this is your first ASIC.
Interested in accelerating your ASIC project while reducing technical risk?
Key ASIC helps clients navigate the full design journey from spec to tape-out to final chip, with the goal of first-time-right silicon.
Selecting a Turnkey Service Partner that has Perfect Track Record with Over 100 Chips in Production:
Key ASIC, listed on Bursa Malaysia (0143), is one of the world's leading turnkey ASIC design service companies, offering comprehensive support from design to chip production.
- Over 100 ASIC designs in mass production
- 100% successful ASIC tape out
- Over 150 silicon proven IPs
As a foundry-independent company, we collaborate with top-tier foundries worldwide, providing unparalleled flexibility and expertise to meet our customers' diverse needs.
Key ASIC is here to provide the best partnership for your ASIC business.
Please feel free to contact: info@keyasic.com