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Design Platform and Service News

• Siemens launches Fuse EDA AI Agent for automation across semiconductor, 3D IC and PCB system workflows (Tuesday, March 17, 2026)
• AI Chip Design From Heilbronn (Monday, March 16, 2026)
• TES Unveils High-Performance 8/40MHz Oscillator and Clock Buffer IPs for Reliable On-Chip Timing Solutions for X-FAB XT018 - 0.18µm BCD-on-SOI technology. (Thursday, March 12, 2026)
• Movellus Partners with Synopsys to Deliver Power Efficiency for Next Generation IC’s (Thursday, March 12, 2026)
• Synopsys Launches Electronics Digital Twin Platform to Accelerate Physical AI System Development (Thursday, March 12, 2026)
• Linaro, Arm Launch CoreCollective Open Consortium (Monday, March 9, 2026)
• Innatera Selects Synopsys Simulation to Scale Brain-Inspired Processors for Edge Devices (Wednesday, March 4, 2026)
• Siemens accelerates integrated circuit design and verification with agentic AI in Questa One (Monday, March 2, 2026)
• Kaynes Semicon Pvt Ltd Adopts Advanced Simulation Solutions from Synopsys to Strengthen OSAT Capabilities (Thursday, February 26, 2026)
• Accelerating semiconductor and electronic systems design using AI-powered digital twins (Thursday, February 26, 2026)
• Baya Systems and Aion Silicon Partner to Accelerate Next-Generation SoC and Chiplet Designs (Thursday, February 26, 2026)
• ADTechnology and Fraunhofer IIS Join Forces for Advanced ASIC and Chiplet Development (Thursday, February 26, 2026)
• SmartDV and Mirabilis Design Announce Strategic Collaboration for System-Level Modeling of SmartDV IP (Monday, February 16, 2026)
• Compartmentalisation by Microservices (Thursday, February 12, 2026)
• Keysight Enables Enterprise-Scale AI Adoption in Semiconductor Design with SOS Enterprise (Thursday, February 12, 2026)
• FAMES pilot line inaugurated after delivering first validated semiconductor results (Monday, February 9, 2026)
• Indian Chip Design Services Provider Mirafra Tapes Out 22-nm SoC (Monday, February 2, 2026)
• Keysight’s Machine Learning Toolkit to Speed Device Modeling and PDK Dev (Monday, February 2, 2026)
• Keysight Launches Wireless Coexistence Test Solution to Accelerate Compliance and Innovation (Thursday, January 29, 2026)
• Frontgrade Gaisler is proud to be a part of the ePERFECT project (Monday, January 26, 2026)
• QuickLogic Announces Orders for Strategic Radiation Hardened FPGA Development Kit (Monday, January 26, 2026)
• Microservice Store Launches Embedded Microservices: The Foundational Technology for the Digital Marketplace in Embedded Systems (Monday, January 26, 2026)
• Siemens Introduces New Type of Digital Twin Software for SDV Development (Thursday, January 22, 2026)
• Keysight Joins Forces with Singapore's Quantum Leaders to Advance Capabilities in the Design and Control of Qubits (Thursday, December 18, 2025)
• Using Synopsys Tools, Complex AI SoC Achieves Verification in 5 Weeks (Thursday, December 18, 2025)
• Keysight Accelerates Electronic Design Productivity with Secure AI-Powered Assistants (Thursday, December 18, 2025)
• Toshiba to accelerate semiconductor design innovation with Siemens’ EDA software (Thursday, December 18, 2025)
• Cadence's Zhuo Li discusses how their latest platform is reshaping LEC, low-power signoff, and ECO implementation using AI technologies. (Wednesday, December 17, 2025)
• Certus Semiconductor adopts AI-powered Solido to accelerate IO library, analog IP and ESD development (Thursday, December 4, 2025)
• Synopsys Demonstrates Framework for Optimizing Manufacturing Processes with Digital Twins at Microsoft Ignite (Thursday, November 27, 2025)
• Three Ethernet Design Challenges in Industrial Automation (Thursday, November 20, 2025)
• Siemens and Microsoft team up to deliver Polarion X on Azure (Thursday, November 20, 2025)
• SAICEC and Siemens to accelerate chip-to-vehicle validation using digital twin technology (Tuesday, November 18, 2025)
• Thalia Design Automation announces AMALIA Platform release 25.3 qualified for advanced process nodes down to 4nm (Thursday, November 6, 2025)
• Keysight Advances Quantum Engineering with New System-Level Simulation Solution (Monday, November 3, 2025)
• SiPearl Unveils Athena1 Processor for Europe’s Dual-Use Needs (Thursday, October 23, 2025)
• Arm Sets the Standard for Open, Converged AI Data Centers (Wednesday, October 15, 2025)
• Sumitomo Riko Leverages Ansys AI Technology to Accelerate Simulation Over 10x for Automotive Component Design and Manufacturing (Thursday, October 9, 2025)
• Siemens and ASE collaborate on Innovator3D IC driven 3Dblox workflows for ASE's VIPack platform (Monday, October 6, 2025)
• Siemens Unveils "Groundbreaking" Software for Automated Analog IC Tests (Monday, October 6, 2025)
• Synopsys Introduces Digital Twin Racetrack and NVIDIA Omniverse to STEM Racing (Monday, September 29, 2025)
• The Quantum Race: Finding Europe's Formula 1 (Thursday, September 25, 2025)
• Synopsys Collaborates with TSMC to Drive the Next Wave of AI and Multi-Die Innovation (Thursday, September 25, 2025)
• Siemens collaborates with TSMC to accelerate 3D IC and AI-driven circuit and systems design (Thursday, September 25, 2025)
• Cadence Partners with TSMC to Power Next-Generation Innovations Using AI Flows and IP for TSMC Advanced Nodes and 3DFabric (Thursday, September 25, 2025)
• Siemens adds AI to Simcenter Testlab to reinvent modal testing and analysis processes (Wednesday, September 24, 2025)
• Thalia and X-FAB Forge Strategic Partnership to Safeguard Supply and Accelerate IP Migration (Tuesday, September 23, 2025)
• Siemens accelerates complex semiconductor design and test with Tessent IJTAG Pro (Tuesday, September 23, 2025)
• Analog Power Conversion LLC adopts Silvaco’s Design Technology Co-Optimization Flow for Next Generation Silicon and Silicon Carbide Power Devices (Tuesday, September 16, 2025)
• Siemens unveils groundbreaking Tessent AnalogTest software for automated analog circuit test generation (Tuesday, September 16, 2025)