Oct. 06, 2025 –
Detachable fiber devices based on glass waveguides will connect PICs with fibers.
Chip maker GlobalFoundries (GF), which is also a major player in silicon photonics production, has revealed details of a collaboration with the fiber-optics giant Corning targeting co-packaged optics (CPO) interconnects for AI data centers.
The firms say that Corning’s “GlassBridge” technology, a glass-waveguide based edge-coupler compatible with the v-grooves used in GF’s silicon photonics platform, is wanted for high-bandwidth, power-efficient optical links.
“Other coupling mechanisms are also being developed, including a vertically-coupled detachable fiber-to-PIC (photonic integrated circuit) solution - demonstrating GlobalFoundries and Corning’s combined ability to produce multiple forms of co-packaged PIC-to-fiber connectivity,” they announced.