Oct. 30, 2025 –
YOKOHAMA, Japan and MILPITAS, Calif. -- Socionext Inc., a global leader in System-on-Chip (SoC) design and advanced semiconductor solutions, introduces "Flexlets", a new class of configurable chiplets designed to advance heterogenous integration.
As traditional monolithic SoC designs face physical and economic limits—reticle size constraints, yield challenges, and thermal bottlenecks- the industry is turning toward chiplet-based design, where designers can integrate their core features and interface functionalities, provided as chiplets, into a packaged device to improve performance, cost, and accelerate time-to-market.
While chiplet technology opens exciting possibilities for modular designs and scalability, many current solutions are derived from fixed-function ASSPs, limiting flexibility and customization. Socionext's Flexlets overcome this by offering a configurable library of chiplet designs at the RTL level. Unlike traditional approaches, Flexlets empower customers to tailor performance to their unique application needs – whether in high-performance computing, advanced networking, or next-generation automotive systems.
Unlike competitors who are limited to their own ecosystem, Flexlets from Socionext enable customers to co-design differentiated features by integrating best-in-class IP from any vendor. This flexibility is a game-changer for companies aiming to deliver state-of-the-art designs with optimized power, performance, and area (PPA) in a competitive market.