Oct. 27, 2025 –
As the semiconductor industry continually pushes technological boundaries, some companies are developing a new microchip generation built on semiconductor nodes under 2 nanometers. They have dealt with numerous sub-2-nm chip challenges, such as the fact that traditional lithography techniques cannot accommodate this size, and the extremely small scale complicates quality control.
Some manufacturing companies believe advanced deposition chemistry could overcome some of these obstacles. The ongoing progress supports related efforts, including when Korean researchers published a 271-page paper about the evolution of high-bandwidth technologies. Decision-makers can use this HBM roadmap and other resources to determine when and how to develop and deploy the technologies needed for 2-nm chip production.
Manufacturers using advanced chemical deposition technologies, such as atomic layer deposition (ALD) and chemical vapor deposition (CVD), create semiconductors’ intricate structures. They do this by precisely controlling chemical reactions or by changing gaseous materials (precursors) into thin, solid layers. Against this backdrop, which specific techniques may prove most instrumental in the future of 2-nm chips?
Atomic layer deposition (ALD) is increasingly recognized as essential for 2-nm node fabrication, particularly by professionals in advanced manufacturing. Major foundries, including TSMC, have invested heavily in integration despite the associated per-unit costs. Scalability goals, such as projected monthly output targets of 50,000 units, illustrate the sector’s commitment to advanced ALD.