InPsytech showcases 3nm UCIe 3.0 at OCP 2025, accelerating innovation in chiplet ecosystem

Nov. 27, 2025 – 

Highlights InPsytech's advanced R&D capabilities in chiplet interconnect technology and its role in supporting Egis Group's broader strategy in semiconductor design and heterogeneous integration.

By DQI

InPsytech, a subsidiary of Egis Technology specializing in high-speed interface intellectual property (IP) development, participated in the Open Compute Project (OCP) Global Summit 2025, held in San Jose, California, recently.

At the event, InPsytech showcased its latest 3nm UCIe high-speed interface technology demo, featuring support for the newest UCIe 3.0 standard, 3D packaging integration, and ultra-high-speed, low-power performance. This demonstration highlights InPsytech's advanced R&D capabilities in chiplet interconnect technology and its role in supporting Egis Group's broader strategy in semiconductor design and heterogeneous integration.

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