Dec. 16, 2025, Dec. 16, 2025 –
BOS Semiconductors has entered into a strategic memorandum of understanding (MOU) with LIG Nex1, a leader in advanced defense and robotics technologies, to collaborate on the development of Physical AI solutions for robotics and drone applications.
Signed on November 28, the agreement reflects a shared vision between the two companies to advance next-generation Physical AI and On-Device AI technologies, accelerating their path toward real-world deployment and commercialization.
Physical AI refers to AI models embedded directly into devices, enabling robots and drones to perceive their surroundings, make decisions, and act autonomously in physical environments. By minimizing dependence on cloud-based computation, Physical AI enables real-time perception, inference, and control, while significantly improving latency, security, and power efficiency—key requirements for autonomous systems operating in unmanned and mission-critical environments.
As the demand for intelligent and autonomous robotic systems continues to grow, Physical AI is rapidly emerging as a core technology shaping the next generation of robotics and drone platforms. Through this collaboration, BOS Semiconductors aims to strengthen its leadership in Physical AI semiconductors and accelerate innovation across the robotics and drone ecosystem.