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Artificial Intelligence News

• Memory Is the New Compute: Why SK Hynix’s Investment in Semidynamics Signals a Structural Shift in AI Architecture (Monday, April 20, 2026)
• DeepX to produce next AI chip using Samsung Foundry’s 2-nanometer process (Thursday, April 16, 2026)
• How to Plan Agentic AI Deployment for Chip Design (Thursday, April 16, 2026)
• Cadence and NVIDIA Expand Partnership to Reinvent Engineering for the Age of AI and Accelerated Computing (Thursday, April 16, 2026)
• AimFuture, a Leader in Home Appliance NPUs, to Integrate Mesacure Company’s AI Algorithms (Thursday, April 16, 2026)
• Faraday Delivers IP Solutions to Enable Endpoint AI Based on UMC’s 28nm SST eFlash (Thursday, April 16, 2026)
• Intel, Google Deepen Collaboration to Advance AI Infrastructure (Monday, April 13, 2026)
• Socionext Collaborates with Arm to Advance AI Data Center Infrastructure with Arm Total Design (Monday, April 13, 2026)
• BrainChip Unveils Radar Reference Platform to Bridge the ‘Identification Gap’ in Edge AI (Monday, April 13, 2026)
• Silicon Choices Grow in Importance as Industrial AI Moves Closer to the Factory Floor (Thursday, April 9, 2026)
• AD Technology targets North American AI-RAN and DRAN markets (Thursday, April 9, 2026)
• IBM Announces Strategic Collaboration with Arm to Shape the Future of Enterprise Computing (Monday, April 6, 2026)
• Can Your NPU Run DOOM? Chimera Can. (Monday, April 6, 2026)
• EDGEAI to Revolutionize Smart Metering with BrainChip Akida 2 License (Thursday, April 2, 2026)
• Altera and Arm Collaborate to Deliver Efficient, Programmable Solutions for AI Data Centers (Monday, March 30, 2026)
• Innatera Launches Synfire to Unify the Neuromorphic Ecosystem and Accelerate Real-World Edge AI Deployment (Monday, March 30, 2026)
• These AI Workstations Look Like PCs, but Pack a Stronger Punch (Monday, March 30, 2026)
• Cadence and NVIDIA Unveil Accelerated Engineering Solutions Purpose-Built for Agentic AI Chip and System Design​ (Thursday, March 26, 2026)
• AimFuture and ITM Semiconductor to Develop AI-Integrated Technology for Robotics and Mobility (Monday, March 23, 2026)
• ForwardEdge ASIC Selects BrainChip’s Neuromorphic Computing for Future ASICs (Monday, March 23, 2026)
• STMicroelectronics expands 800 VDC AI datacenter power conversion portfolio with new 12V and 6V architectures in collaboration with NVIDIA (Thursday, March 19, 2026)
• Synopsys Showcases NVIDIA Partnership Impact and Ecosystem Innovation at GTC 2026 (Thursday, March 19, 2026)
• Mythic® Selects memBrain™ Technology from Silicon Storage Technology® for its Next Generation of Ultra-Low-Power Analog Processing Units (Thursday, March 19, 2026)
• Cadence and NVIDIA Unveil Accelerated Engineering Solutions Purpose-Built for Agentic AI Chip and System Design​ (Thursday, March 19, 2026)
• Ceva’s NeuPro-Nano NPU Wins Artificial Intelligence Award at embedded world 2026 (Monday, March 16, 2026)
• BrainChip Enables the Next Generation of Always-On Wearables with the AkidaTag© Reference Platform (Monday, March 16, 2026)
• Klepsydra Technologies and BrainChip Announce Strategic Partnership to Deliver Heterogeneous AI Runtime for Akida™ Neuromorphic Processors (Monday, March 16, 2026)
• Keysight Debuts Purpose-Built 1.6T Ethernet AI Workload Emulation Platform to Validate Next-Generation AI Fabrics (Thursday, March 12, 2026)
• Axelera® AI Adds Kudelski Labs’ Security IP to Europa® Chip to Enable Secure, High-Performance Edge AI (Thursday, March 12, 2026)
• Synopsys Launches Electronics Digital Twin Platform to Accelerate Physical AI System Development (Thursday, March 12, 2026)
• Nvidia Advances AI-Native Strategy at MWC (Monday, March 9, 2026)
• Keysight and Samsung Demonstrate End-to-End AI-RAN Validation Workflow with NVIDIA (Thursday, March 5, 2026)
• Samsung Electronics Announces Strategy To Transition Global Manufacturing Into ‘AI-Driven Factories’ by 2030 (Monday, March 2, 2026)
• SEMIFIVE Partners with Niobium to Develop FHE Accelerator, Driving U.S. Market Expansion (Monday, February 23, 2026)
• Production-Ready, Full-Stack Edge AI Solutions Turn Microchip’s MCUs and MPUs Into Catalysts for Intelligent Real-Time Decision-Making (Thursday, February 19, 2026)
• BrainChip Announces Immediate Availability of Akida™ Pico for Remote Evaluation via FPGA Cloud (Monday, February 16, 2026)
• Physical AI: Fueling the Next Wave of Semiconductor Growth (Thursday, February 12, 2026)
• Arteris Technology Deployed More Broadly by NXP to Accelerate Edge AI Leadership (Thursday, February 12, 2026)
• Cadence Unleashes ChipStack AI Super Agent, Pioneering a New Frontier in Chip Design and Verification (Wednesday, February 11, 2026)
• Keysight and Point2 Technology Collaborate to Advance Next-Generation AI Scale-Up Interconnects (Thursday, February 5, 2026)
• Siemens acquires Canopus AI to bring AI-based metrology to semiconductor manufacturing (Thursday, February 5, 2026)
• Synopsys and AMD Honored by World Economic Forum for Generative and Agentic AI Vision, Leadership, and Impact (Monday, February 2, 2026)
• Korea, Italy agree to deepen ties in AI, chips, space and beyond (Monday, January 26, 2026)
• Warning signs for semiconductor market in AI boom (Monday, January 26, 2026)
• EU Council backs creation of AI gigafactories in Europe (Thursday, January 22, 2026)
• Spiking Performance in AI Applications (Thursday, January 22, 2026)
• Keysight Unveils Machine Learning Toolkit to Accelerate Device Modeling and PDK Development (Monday, January 19, 2026)
• TSMC Will Struggle to Meet AI Demand for Years, Analysts Say (Monday, January 19, 2026)
• Quadric's SDK Selected by TIER IV for AI Processing Evaluation and Optimization, Supporting Autoware Deployment in Next-Generation Autonomous Vehicles (Friday, January 16, 2026)
• AI Boom Reshapes Global Semiconductor Supply Chains (Thursday, January 15, 2026)