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Artificial Intelligence News

• Samsung Foundry begins full mass production of Nvidia's Groq 3 LPX chip (Monday, August 31, 2026)
• Arm Reveals AGI Server CPU Architecture at Hot Chips, Targeting Agentic AI Workloads (Monday, August 31, 2026)
• Semifive accelerates Korea's AI chip design with turnkey ASIC platform (Monday, August 31, 2026)
• Korea's AI ambition faces power crunch (Thursday, August 27, 2026)
• Baya Systems Expands to Japan to Support Next-Generation AI Semiconductor Design (Thursday, August 27, 2026)
• BrainBoard1500 brings neuromorphic AI to embedded developers (Thursday, August 27, 2026)
• BrainChip’s AkidaTag Wins Global AI Award for Edge AI & IoT Intelligence (Thursday, August 27, 2026)
• Arteris: High Premium For AI Chip IP (Monday, August 24, 2026)
• SkyeChip's AI expansion to yield meaningful earnings from 2029 (Thursday, August 20, 2026)
• BrainChip and Neuromorphyx Announce an AKD1500 Embedded Developer Board, Bringing Neuromorphic AI to the Embedded Engineering Community (Thursday, August 20, 2026)
• European AI factories everywhere, still Nvidia (Monday, August 17, 2026)
• BrainChip Partners With Orama.AOI For AI-Fueled Defect Detection (Monday, August 17, 2026)
• BrainChip CEO Sean Hehir Talks Edge AI and the Future of Autonomous Drones (Thursday, August 13, 2026)
• SkyeChip Well Positioned To Capitalise On Global AI Semiconductor Growth (Monday, August 10, 2026)
• Samsung Unveils Next-Gen 3D-Memory Vision at FMS 2026, Charting the Future of AI Infrastructure (Thursday, August 6, 2026)
• Tenstorrent Sets New Performance Records, Launches TT- Ascalon S, and Expands Across Japan (Thursday, August 6, 2026)
• Andes Technology Unveils Next-Generation AI Solutions: AndesAIRE™ AnDLA™ I370 v2.0 and NN SDK v1.2.0 for Advanced ViT, VLM, and SLM at the Edge (Thursday, August 6, 2026)
• Dnotitia’s Seahorse AI Storage Wins AI Application Award at FMS 2026 (Tuesday, August 4, 2026)
• From Trust to Action: Building the Foundations of Trustworthy, Physical AI (Monday, August 3, 2026)
• Making Neuromorphic Edge AI Design-Ready with Verified ECAD Models (Monday, August 3, 2026)
• Researchers Explore Next-Generation AI Architectures Using Weebit ReRAM (Monday, August 3, 2026)
• Stealthium and Tenstorrent Partner to Deliver Runtime Observability for AI Infrastructure (Monday, August 3, 2026)
• BrainChip AKD1500 Now Available in Compact M.2 Form Factor, Enabling Fanless Edge AI in Industrial and Commercial Designs (Wednesday, July 29, 2026)
• Synopsys Showcases Comprehensive Autonomous Engineering Workflows from Silicon to Systems, Developed with NVIDIA Technology (Monday, July 27, 2026)
• Agnisys unveils IDS-AI agentic framework and NoC automation at DAC 2026 (Thursday, July 23, 2026)
• Intelligent and Adaptive AR Experiences with TDK (Thursday, July 23, 2026)
• Siemens to acquire Precision Innovations to expand AI-powered system-on-a-chip design exploration and optimization (Thursday, July 23, 2026)
• BrainChip Partners with Celus to Bring Its Neuromorphic Edge AI Processor to the CELUS Design Platform (Thursday, July 23, 2026)
• ZeroPoint Technologies Announces ZeroStream (Monday, July 20, 2026)
• Siemens expands Saskatoon R&D hub to advance Industrial AI in semiconductor design (Thursday, July 16, 2026)
• Axelera AI Publicly Releases Voyager Wingman, an AI Assistant That Speeds Application Development (Thursday, July 16, 2026)
• Dnotitia Unveils STAR-KV, Achieving UP to 20x KV CacheCompression, Selected as an ICML 2026 Spotlight Paper (Thursday, July 16, 2026)
• EU unveils action plan for AI and cybersecurity (Monday, July 13, 2026)
• SiPearl CEO Philippe Notton on Europe’s AI processors, chiplets, and semiconductor sovereignty (Monday, July 13, 2026)
• The Dawn of Agentic AI Super-Agents (Monday, July 13, 2026)
• Turning light into trusted data: how STMicroelectronics is reinventing Imaging for the AI era (Thursday, July 9, 2026)
• Samsung Begins Mass Production of PM1763 SSD Optimized for Next-Generation AI Infrastructure (Thursday, July 9, 2026)
• Synopsys Debuts ESUN IP for Breaking AI ‘Slowest Packet’ Bottleneck (Thursday, July 2, 2026)
• Perforce Intelligence Advances Control and Trust for AI Workflows (Thursday, July 2, 2026)
• BrainChip Announces Commercial Availability and Production Shipments of AKD1500 Neuromorphic Processors (Thursday, July 2, 2026)
• NVIDIA Vera Rubin Delivers World-Class Supercomputers for Science (Monday, June 29, 2026)
• PREVAIL: A Unique European Testing Platform for Edge AI (Monday, June 29, 2026)
• Jim Keller: ‘AI Still Obeys the Old Laws of Compute’ (Monday, June 29, 2026)
• EdgeAI Licensed Andes Technology CPU IP to Power Next-Generation Edge AI Neuromorphic Solution (Monday, June 29, 2026)
• Soofi announces model for industrial AI in Europe (Thursday, June 25, 2026)
• Siemens recognized as a Visionary in Gartner Magic Quadrant for AI Platforms for Data Science and Machine Learning (Thursday, June 25, 2026)
• BrainChip Unveils Communication Reference Platform, Fueling Signal Intelligence at the Edge (Thursday, June 25, 2026)
• Gov’t joins hands with Samsung to support AI chip development (Thursday, June 18, 2026)
• CEA-Leti Scales Ferroelectric RAM to 22nm Node, Unlocking Denser, More Efficient Memory for Edge AI (Thursday, June 18, 2026)
• Arm delivers a step-change in mobile gaming with Neural Dawn, showcasing the first use of Arm Neural Technology and Unreal Engine MegaLights on mobile (Monday, June 15, 2026)