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Artificial Intelligence News

• ZeroPoint Technologies Announces ZeroStream (Monday, July 20, 2026)
• Siemens expands Saskatoon R&D hub to advance Industrial AI in semiconductor design (Thursday, July 16, 2026)
• Axelera AI Publicly Releases Voyager Wingman, an AI Assistant That Speeds Application Development (Thursday, July 16, 2026)
• Dnotitia Unveils STAR-KV, Achieving UP to 20x KV CacheCompression, Selected as an ICML 2026 Spotlight Paper (Thursday, July 16, 2026)
• EU unveils action plan for AI and cybersecurity (Monday, July 13, 2026)
• SiPearl CEO Philippe Notton on Europe’s AI processors, chiplets, and semiconductor sovereignty (Monday, July 13, 2026)
• The Dawn of Agentic AI Super-Agents (Monday, July 13, 2026)
• Turning light into trusted data: how STMicroelectronics is reinventing Imaging for the AI era (Thursday, July 9, 2026)
• Samsung Begins Mass Production of PM1763 SSD Optimized for Next-Generation AI Infrastructure (Thursday, July 9, 2026)
• Synopsys Debuts ESUN IP for Breaking AI ‘Slowest Packet’ Bottleneck (Thursday, July 2, 2026)
• Perforce Intelligence Advances Control and Trust for AI Workflows (Thursday, July 2, 2026)
• BrainChip Announces Commercial Availability and Production Shipments of AKD1500 Neuromorphic Processors (Thursday, July 2, 2026)
• NVIDIA Vera Rubin Delivers World-Class Supercomputers for Science (Monday, June 29, 2026)
• PREVAIL: A Unique European Testing Platform for Edge AI (Monday, June 29, 2026)
• Jim Keller: ‘AI Still Obeys the Old Laws of Compute’ (Monday, June 29, 2026)
• EdgeAI Licensed Andes Technology CPU IP to Power Next-Generation Edge AI Neuromorphic Solution (Monday, June 29, 2026)
• Soofi announces model for industrial AI in Europe (Thursday, June 25, 2026)
• Siemens recognized as a Visionary in Gartner Magic Quadrant for AI Platforms for Data Science and Machine Learning (Thursday, June 25, 2026)
• BrainChip Unveils Communication Reference Platform, Fueling Signal Intelligence at the Edge (Thursday, June 25, 2026)
• Gov’t joins hands with Samsung to support AI chip development (Thursday, June 18, 2026)
• CEA-Leti Scales Ferroelectric RAM to 22nm Node, Unlocking Denser, More Efficient Memory for Edge AI (Thursday, June 18, 2026)
• Arm delivers a step-change in mobile gaming with Neural Dawn, showcasing the first use of Arm Neural Technology and Unreal Engine MegaLights on mobile (Monday, June 15, 2026)
• Dnotitia Releases DNA 3.0, an Enterprise-Ready AI Language Model Family (Monday, June 15, 2026)
• NVIDIA and TSMC push AI deeper into semiconductor fabs (Monday, June 8, 2026)
• Chairman Chey Tae-won Meets TSMC Chairman C.C. Wei: "Strengthening Global AI Alliance" (Monday, June 8, 2026)
• Siemens and partners develop reference architecture purpose-built for NVIDIA AI data centers (Thursday, June 4, 2026)
• INTERA Group Announces Next-Generation Neuromorphic Semiconductor Platform (Thursday, May 28, 2026)
• BrainChip Expands AI Ecosystem with Strategic Software Partners (Monday, May 25, 2026)
• Dnotitia Open-Sources AKB on GitHub, an Agent-Native Knowledge Infrastructure for Enterprise AI (Monday, May 25, 2026)
• BrainChip Strikes IP Licensing Deal with ASICLAND (Monday, May 25, 2026)
• Development of High-Precision Nonvolatile Analog Computing-in-Memory Technology Enabling Ultra-Low-Power AI Hardware (Thursday, May 21, 2026)
• AI chip startup Tenstorrent draws takeover interest from Intel, Qualcomm (Thursday, May 21, 2026)
• SkyeChip to expand into AI silicon products (Thursday, May 21, 2026)
• BOS Semiconductors Selected for CB Insights "AI100"; Joins Global Group of 11 Physical AI Companies (Wednesday, May 20, 2026)
• Smallest.ai and Tenstorrent Partnership Democratises Voice AI - 4x reduction in cost through hardware acceleration (Monday, May 18, 2026)
• NVIDIA and Corning partner on AI photonics expansion (Monday, May 11, 2026)
• Renesas Completes Acquisition of Irida Labs to Expand Vision AI Software Capabilities and Accelerates System-Level Vision Solutions (Monday, May 11, 2026)
• AI demand reshapes semiconductor capacity and intensifies supply chain competition (Thursday, May 7, 2026)
• AI Transforms the Chip Industry (Monday, May 4, 2026)
• The great data center delay: Why your AI chips are stuck in 2026 (Monday, May 4, 2026)
• GUC Collaborate with Wiwynn to Advance Silicon-to-System Infrastructure for Next-Generation Hyperscale AI (Monday, May 4, 2026)
• Korea Semiconductor Association Expands AI Innovation Center in Silicon Valley (Thursday, April 30, 2026)
• Microcontrollers for Machine Learning (Thursday, April 30, 2026)
• Tenstorrent Unveils Next-Gen Servers for Fast Tokens, No Disaggregation Needed (Thursday, April 30, 2026)
• MIPI Alliance Launches Physical AI Birds of a Feather (BoF) Group Focused on Humanoids (Thursday, April 30, 2026)
• IC Manage Advances GDP-AI for Custom IC Design with Virtuoso (Wednesday, April 29, 2026)
• Rambus Enables Power-Efficient AI Platforms with SOCAMM2 Server Module Chipset (Monday, April 27, 2026)
• LLMs in Transition: What Research, Real World Practice, and Europe Are Driving Forward Today (Thursday, April 23, 2026)
• Arteris and MIPS Partner to Accelerate Development for Physical AI Platforms (Tuesday, April 21, 2026)
• Memory Is the New Compute: Why SK Hynix’s Investment in Semidynamics Signals a Structural Shift in AI Architecture (Monday, April 20, 2026)