BOS Semiconductors, Dec. 24, 2025 –
SEOUL, South Korea — December 24, 2025 — BOS Semiconductors, a fabless semiconductor company specializing in automotive and physical AI semiconductors, today announced that it will participate in CES 2026, the world’s largest technology exhibition, taking place in Las Vegas, USA from January 6–9, 2026. At the event, BOS will unveil an AI Box demo designed for next-generation mobility.
At CES 2026, BOS will highlight its strategy aligned with major industry trends, including the advancement of autonomous driving, the shift toward Software Defined Vehicles (SDVs), and the expansion of Physical AI. Through the demonstrations, BOS will present how to anticipate emerging needs in mobility AI environments—such as: Support for a wide range of AI models based on CNN and Transformer architectures, Flexible scalability and integration with existing automotive electronic systems, Real-time perception and decision-making enabled by physical AI
To support these capabilities, BOS will showcase AI model demos powered by its AI Box integrating the high-performance AI accelerator Eagle-N. The AI Box is an external AI computing module that allows automakers (OEMs) to add an “AI brain” to vehicles without replacing existing in-vehicle infotainment (IVI) systems, enabling fast AI expansion with minimal platform change.
With the AI Box, OEMs can minimize changes to their existing systems while extending high-performance AI functionality independently. This approach accelerates adoption of advanced AI capabilities not only in new vehicles but also in facelift models—updated versions of existing vehicles with enhanced design and features—reducing development cost and time while improving long-term product competitiveness.
The AI Box is based on an on-device AI architecture, delivering several advantages. Sensitive data such as voice and video can be processed directly inside the vehicle rather than being transmitted to the cloud, strengthening privacy protection and data security. It also ensures stable AI operation regardless of network connectivity, improving overall reliability. Over the long term, the AI Box can reduce total cost of ownership (TCO) by lowering cloud traffic, inference, and storage costs. In addition, it offers strong scalability without requiring server expansion as the number of users increases.
BOS’ AI Box is designed to integrate flexibly with existing vehicle systems through multiple interfaces, enabling an efficient AI vehicle architecture based on clear role separation: AI-intensive functions are handled by the AI Box, while existing systems continue performing their original roles. At the booth (Venetian Expo, Hall A, Booth #50017), BOS will demonstrate on-device AI models that combine Vision-Language Models (VLMs) and Large Language Models (LLMs) based on the AI Box architecture. The demo will also be showcased at the Tenstorrent Demo Room as well.
“Through our AI Box demo with Eagle-N at CES 2026, we will present a practical approach for effectively scaling AI capabilities even on existing mobility system,” said Jason (Jeongseok) Chae, Vice President and Head of Strategic Marketing & Sales at BOS. “We aim to evolve beyond automotive semiconductors and become a core semiconductor company leading the era of Physical AI.”
About BOS Semiconductors
BOS Semiconductors is a fabless semiconductor company developing high-performance automotive semiconductors and AI accelerator solutions for autonomous driving and in-vehicle infotainment systems. With automobiles as its primary target market, the company is expanding its technology platform into broader Physical AI applications, including robotics and intelligent machines, leveraging the same product architecture across multiple mobility domains.
BOS Semiconductors’ products—Eagle-N, a high-performance AI accelerator, and Eagle-A, an automotive System-on-Chip (SoC)—deliver optimized performance and power efficiency for next-generation vehicle electronics and intelligent systems. Built on chiplet-based scalability and advanced process technologies, these solutions enable flexible expansion of AI compute capabilities.
At CES 2026, BOS will showcase its AI Box, an external physical AI computing module powered by Eagle-N, demonstrating a practical approach to scaling AI capabilities in vehicles without replacing existing in-vehicle platforms.