Jan. 22, 2026 –
Samsung is stepping up its development of custom HBM logic dies. According to ZDNet, sources say the company is designing logic dies for custom HBM using foundry process nodes as advanced as 2nm. The report adds that Samsung Electronics previously applied a 4nm process to the logic die used in HBM4 (sixth-generation HBM), which is set to enter commercial production this year.
As HBM technology advances, the design and manufacturing approach for logic dies has evolved accordingly, the report explains. Beginning with HBM4, which is scheduled for mass production in 2026, the logic die is manufactured using a foundry process rather than a conventional DRAM process, reflecting the performance and power-efficiency advantages of foundry manufacturing.
In Samsung Electronics’ case, the report says the company uses a 4nm process for the HBM4 logic die. This approach is regarded as a strategic move to secure a performance advantage over SK hynix, which has adopted a 12nm process from TSMC.