Jan. 29, 2026 –
MosChip’s approach to turnkey ASIC execution for global and Indian customers
By Yashasvini Razdan, EE Times
MosChip Technologies has completed the first silicon bring-up of a custom 28-nm SoC for the Space Applications Centre (SAC) in India under an end-to-end turnkey ASIC program.
The program covered design implementation, packaging, and post-silicon validation by MosChip. Engineering samples have been delivered and validated, allowing SAC to move into the next phase of productization.
SAC operates under the Indian Space Research Organization (ISRO) and is responsible for the design and development of satellite payloads and space-born systems. Its work spans earth observation, communication, navigation, and scientific missions for national and international users.
Following tape-out, MosChip carried out substrate design for a 10-layer FC-CBGA package and completed assembly and validation of engineering samples on automated test equipment. The silicon was verified against specifications, confirming functional correctness.