February 9, 2026 -
By Max Maxfield, eeJournal
Things continue to gain traction in “chiplet space” (where no one can hear you scream). In fact, before I forget, Chiplet Summit 2026 takes place in just a couple of weeks as I pen these words. The organizers say this is the place to “see and be seen” if you are in any way dabbling your toes in the chiplet waters (I’m paraphrasing, of course).
Not surprisingly, one of the keynote presentations at the Chiplet Summit will be given by Cadence, which is doing some very interesting things on the chiplet front. This presentation will be given by David Glasco, VP Compute Solutions Group at Cadence. David oversees hardware/software design and implementation of soft IP for AI, and his presentation will cover modular multi-die designs for AI, edge, and physical AI applications.
Hmmm, “physical AI applications.” Reading this made me think, “What’s that when it’s at home?” as people say in England. Fortunately, I was just chatting with Michael Posner, Sr Product Marketing Group Director, Chiplets & IP solutions at Cadence. Michael explained that physical AI is any system that performs AI processing at the edge, including autonomous vehicles, drones, and robots.