Design & Reuse

SkyeChip’s UCIe 3.0 Advanced Package PHY IP for SF4X Listed on Samsung Foundry CONNECT

February 12, 2026 -

Penang, Malaysia – F SkyeChip Berhad today announced that its UCIe-Advanced Package 32G PHY IP has been officially listed on Samsung Foundry CONNECT, Samsung Foundry’s IP ecosystem platform. This listing marks an important milestone in SkyeChip’s support for advanced die-to-die (D2D) interconnect solutions targeting next-generation chiplet-based SoCs.

The 32G UCIe-Advanced PHY IP is implemented on Samsung Foundry LN04LPP (SF4X) technology and is designed to support 32GT/s UCIe Advanced Package (AP) applications with enhanced reliability. The IP is optimised for high-performance D2D connectivity and flexible placement across North-South and West-East orientations, enabling efficient integration into complex SoC floorplans.

The IP is currently DK-ready, allowing customers to begin early design and integration activities. The solution is intended to support scalable chiplet architectures, helping customers accelerate development timelines while maintaining signal integrity and robustness at advanced data rates.

“Being listed on Samsung Foundry CONNECT demonstrates our continued commitment to delivering high-quality, foundry-aligned interface IP in Samsung Foundry,” said Teck Joo Goh, Corporate VP of Strategic Accounts and Ecosystem Partnerships, SkyeChip Berhad. “Our UCIe-A 32G PHY IP is designed to support customers as they move toward disaggregated, chiplet-based designs on advanced process nodes.”

The availability of SkyeChip’s UCIe Advanced PHY IP on Samsung CONNECT enables Samsung Foundry customers to directly discover, evaluate, and engage with SkyeChip as part of their advanced packaging and chiplet ecosystem.

About SkyeChip Berhad

SkyeChip Berhad is a Penang, Malaysia-based semiconductor IP and design solutions company specialising in high-speed, high-bandwidth memory interfaces, interconnects, and system-on-chip enablement technologies. SkyeChip’s products serve global customers in AI, data center, and advanced computing markets.