Catalog of SIP Cores
System on Chip design resources
System on Chip design resources
June 18, 2026 -
By Neil Tyler, NewElectronics
The UK Semiconductor Centre (UKSC) and Japanese chipmaker Rapidus have signed a memorandum of understanding (MoU) aimed at improving UK industry access to advanced semiconductor manufacturing and prototyping capabilities.
The agreement is intended to strengthen collaboration between the UK and Japan by connecting their respective expertise and infrastructure. It also seeks to support UK companies in accelerating product development and improving their competitiveness in global markets.
Under the partnership, the UKSC will act as a facilitator, helping eligible UK organisations engage with Rapidus and enabling wider cooperation between the two countries’ semiconductor ecosystems.
Rapidus, based in Tokyo, is developing next-generation semiconductor manufacturing processes, including 2nm technology, which is expected to be used in advanced computing and artificial intelligence applications. The company has been building its capabilities since its launch in 2022 with support from industry and the Japanese government, with plans to begin operations in the second half of fiscal year 2027.