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System on Chip design resources
System on Chip design resources
June 29, 2026 -
As demand grows for faster and more power-efficient chip connectivity, a newly taped-out USB IP aims to support next-generation AI, HPC, and mobile applications.
By T Pavani, electronicsforu.com
Taiwanese semiconductor IP provider M31 Technology has announced the successful tapeout of its eUSB2V2 interface IP on TSMC’s N2P process technology, marking a significant advancement in the development of next-generation semiconductor solutions.
The eUSB2V2 interface IP was developed in collaboration with TSMC and is designed to deliver high-speed connectivity while maintaining low power consumption. The solution remains compatible with the USB 2.0 ecosystem and supports operating voltages of 1.2V and 0.9V, making it suitable for advanced chip designs targeting artificial intelligence (AI), high-performance computing (HPC), and mobile devices.