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System on Chip design resources
System on Chip design resources
September 3, 2026 -
TSMC is expanding its semiconductor operations in Kaohsiung with a new verification line being set up in the Baipu Industrial Park, a move that local officials believe will boost southern Taiwan’s role in advanced chip manufacturing and packaging. The project is designed to better connect equipment and material suppliers with real production needs, giving them a dedicated space to test hardware, software and process integration before entering large-scale fabs run by TSMC or ASE Group.
During a recent semiconductor forum hosted by SEMI, TSMC’s vice president of advanced packaging, He Jun, said the Baipu site is initially planned to cover around 3 hectares and will include two buildings. The facility will introduce a modular key process verification line, helping suppliers complete hardware, software, and process integration verification before moving into mass-production plants.
Kaohsiung Mayor Chen Chi-mai said the city is seizing the opportunity presented by the post-Moore era. As advanced packaging becomes more important for improving chip performance and semiconductor competitiveness, the city sees this as a key growth area. Officials also said Baipu will complement existing semiconductor clusters in Nanzih, Renwu and Ciaotou, helping create a more complete supply chain in the south, from production and equipment to materials and technical services.