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BOS Semiconductors Joins Arm Total Design for Physical AI

September 29, 2026 -

Strengthening Physical AI SoC and Custom Silicon Capabilities to Expand Global Business

PANGYO, South Korea — BOS Semiconductors, a fabless semiconductor company developing AI chips for a wide range of Physical AI applications, including automotive and robotics, has joined the Arm Total Design for Physical AI ecosystem.

Through its participation, BOS Semiconductors plans to expand its technology and business collaboration in Physical AI while leveraging the Arm ecosystem to strengthen both its proprietary semiconductor products and customer-specific custom silicon (ASIC) business.

Arm Total Design for Physical AI connects Arm’s extensive global partner ecosystem across the technology stack. Spanning AI models, software, sensors, compute hardware, virtual platforms, and digital twins, the ecosystem is designed to accelerate solution development and validation while reducing fragmentation across technologies. According to Arm, more than 80 companies are participating in the ecosystem, with the shared goal of accelerating the development and deployment of Physical AI solutions.

Physical AI refers to AI technologies that extend beyond digital environments to perceive, reason, and act in the physical world through systems such as vehicles, robots, and drones. Implementing Physical AI requires more than AI compute performance alone. It also demands a comprehensive approach to power efficiency, functional safety, memory and interface architecture, real-time control, and software integration.

Automotive is currently one of the most active areas for the development and commercialization of Physical AI. As adoption expands into robotics, drones, industrial automation, and other autonomous systems, demand is expected to grow for semiconductors that combine high performance, power efficiency, scalability, and safety.

Requirements for Physical AI also vary significantly by application, including compute performance, power efficiency, memory architecture, sensor configuration, real-time control, and functional safety. As a result, SoCs and custom silicon optimized for specific applications and customer requirements are becoming increasingly important in complementing general-purpose semiconductor solutions.(Photo: Official launch event for Arm Total Design for Physical AI in China)

BOS Semiconductors has been developing AI SoCs and chiplet-based semiconductor technologies for a broad range of Physical AI applications, including automotive, robotics, drones, and industrial autonomous systems. Its technology capabilities have also gained international recognition, including being named to CB Insights’ AI 100 in the Physical AI category.

By joining Arm Total Design for Physical AI, BOS Semiconductors plans to broaden the scope of its technology collaboration and expand global business opportunities in Physical AI. Through closer collaboration with Arm and ecosystem partners across software, AI models, sensors, compute hardware, and systems, the company aims to improve product development and system integration efficiency while further strengthening its ability to develop semiconductor solutions optimized for individual customer requirements.

BOS Semiconductors also plans to advance its Physical AI SoC and custom silicon solutions through collaboration with automotive OEMs, Tier-1 suppliers, robotics companies, and other system customers, creating business opportunities that extend from technology validation through deployment in commercial products.

In particular, BOS Semiconductors plans to combine Arm-based CPUs with its AI accelerator and chiplet technologies to develop SoCs and custom silicon optimized for individual customer requirements. Depending on system requirements, BOS can optimize CPU, AI accelerator, memory, interface, and chiplet configurations while providing integrated semiconductor design capabilities spanning system architecture definition, RTL design, verification, and mass-production support.

Through the development of its own AI semiconductor products, BOS Semiconductors has accumulated expertise in high-performance AI accelerators and chiplet-based SoC design. The company is developing semiconductor solutions for applications such as automotive and robotics that require high AI compute performance and scalability, and is applying these capabilities not only to its own products but also to customer-specific custom silicon development.

BOS Semiconductors is also strengthening its local presence to support global business expansion. Centered around its headquarters in South Korea, the company is building business development organizations across key markets including the United States, Europe, China, and Japan, supported by local senior executives and professionals with more than 20 years of semiconductor industry experience.

Through this global network, BOS Semiconductors is discussing a range of projects with global automotive OEMs, Tier-1 suppliers, robotics companies, and other Physical AI companies. The company intends to translate technology collaboration within the Arm ecosystem into tangible global customer projects and business opportunities.

(Photo courtesy of Arm)

Jason Chae, Executive Vice President of Strategic Marketing at BOS Semiconductors, said, “BOS Semiconductors is expanding its AI semiconductor business from automotive into a broader range of Physical AI applications, including robotics, drones, and industrial autonomous systems. As Physical AI expands into more applications and system requirements become increasingly diverse, SoCs and custom silicon optimized for each customer’s system will become even more important.”

He added, “By joining Arm Total Design for Physical AI, we will strengthen our technology collaboration with Arm and its ecosystem partners and extend the AI SoC and chiplet design capabilities we have built in automotive into a broader range of Physical AI applications. Through these efforts, we aim to strengthen both our proprietary SoC and custom silicon businesses and turn collaboration with global customers into new business opportunities.”

Going forward, BOS Semiconductors will continue to expand collaboration with Arm and other ecosystem participants while developing AI semiconductors and custom silicon solutions optimized for customer system requirements across automotive, robotics, drones, industrial automation, and other Physical AI applications.