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System on Chip design resources
System on Chip design resources
October 19, 2026 -
By Asma Adhimi, eeNews Europe
IBM and Siemens have announced a research collaboration to advance IBM’s 3D nanostack transistor architecture, targeting the design and manufacturing challenges of future angstrom-scale semiconductors. The partnership will combine IBM’s semiconductor research with Siemens’ electronic design automation (EDA), simulation and lithography expertise to help move the technology closer to commercial production.
The collaboration could have significant implications for the European semiconductor industry, particularly as chipmakers look for new ways to extend transistor scaling beyond conventional designs. For eeNews Europe readers, the work highlights the growing importance of EDA tools and virtual manufacturing techniques in developing next-generation chips for AI and high-performance computing.