Catalog of SIP Cores
System on Chip design resources
System on Chip design resources
October 22, 2026 -
By Jake Saltzman, photonics.com
With its 2026 forecast, photonics market research firm LightCounting is projecting a roughly-10x increase in shipments of silicon-based pluggable modules from 2024’s projected total. As industry strives to meet demand, silicon photonics is fortifying its position as a critical enabling technology both for the scale-up, as well as the sector’s next innovation era, shaped by a transition from front-panel pluggables to advanced interconnect architectures.
Yet the challenges imparted by surging AI workloads and networking infrastructure are highly dynamic. For one, the notion of scaling in this vibrant technology environment envelops the entire industry value chain. This means multiple, distinct bottlenecks and potential chokepoints. As a result, progress is iterative. Fixed-date deployments — specifically, for co-packaged optics (CPO) — are crucial stepping-stones on the road to streamlined productization and the ultimate goal of getting product to end-users. But meeting such a goal on time and via repeatable processes will necessitate hitting new benchmarks, particularly in testing and packaging. Both present unique obstacles.