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System on Chip design resources
November 5, 2026 -
SHANGHAI, China – Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP for the Smart Edge, today announced that Wuxi Linkpower Microelectronics Co., Ltd. (Linkpower), a Chinese semiconductor company specializing in wireless connectivity solutions, has licensed Ceva-Waves™ Bluetooth® Low Energy (BLE) IP for a new generation of connected industrial microcontrollers (MCUs). The agreement expands an established relationship between the companies, building on Linkpower’s existing automotive Bluetooth products incorporating Ceva IP.
Linkpower already ships its L651 Bluetooth product line, built on Ceva IP, for automotive digital key applications. The new agreement takes that experience into the industrial market, where demand for reliable, ultra-low-power wireless connectivity continues to grow across factory automation, industrial sensors, asset tracking and connected equipment.
As industrial systems increasingly transition from wired to wireless connectivity, semiconductor companies face growing requirements for power efficiency, robust connectivity and cost-effective integration. Ceva-Waves BLE IP provides Linkpower with a proven, standards-based solution to address these requirements while accelerating development, reducing integration complexity and shortening time to market.
“We see significant opportunities to bring Bluetooth Low Energy connectivity to a broader range of industrial devices, where power efficiency, reliability and cost are critical,” said Bruce Ye, CEO, Linkpower Microelectronics. “Our experience bringing Ceva-based Bluetooth products to market in the automotive sector gives us confidence in the technology and the team behind it. Expanding our collaboration with Ceva allows us to build on that success as we develop our next generation of connected industrial MCUs.”
“Industrial MCUs represent an important growth opportunity for connectivity as manufacturers look to integrate wireless capabilities into increasingly diverse applications,” said Tal Shalev, Vice President and General Manager of the Wireless IoT Business Unit at Ceva. “Our comprehensive Bluetooth IP portfolio combines ultra-low-power operation, a compact silicon footprint and proven interoperability, giving customers like Linkpower the flexibility to develop competitive wireless solutions while reducing development complexity and time to market.”
Ceva’s comprehensive Ceva-Waves wireless connectivity IP portfolio includes Bluetooth LE, Bluetooth Dual Mode, Bluetooth High Data Throughput (HDT), Wi-Fi and Ultra-Wideband (UWB), supported by integrated hardware and software solutions. These technologies underpin the Connect pillar of Ceva’s strategy to enable devices to Connect, Sense, and Infer as part of the broader industry shift toward Physical AI. Licensed by leading semiconductor companies worldwide, Ceva’s wireless connectivity IP is deployed in billions of devices. For more information on Ceva’s Bluetooth platform, visit https://www.ceva-ip.com/product/ceva-waves-bluetooth/.
Linkpower Microelectronics Co., Ltd. is a fabless semiconductor company headquartered in Wuxi, China. It develops wireless connectivity chips and solutions for automotive and industrial applications, including Bluetooth chips for automotive digital key systems. Linkpower supports its customers with development boards, reference designs and application expertise to shorten their path to production. For more information, visit www.linkpoweric.com.
Ceva powers the Smart Edge, bridging the digital and physical worlds to bring AI-driven products to life. Our Ceva AI fabric portfolio of silicon and software IP enables devices to Connect, Sense, and Infer – the essential capabilities for the intelligent edge. From 5G, cellular IoT, Bluetooth, Wi-Fi, and UWB connectivity to scalable Edge AI NPUs, AI DSPs, sensor fusion processors and embedded software, Ceva provides the foundational IP for devices that connect, understand their environment, and act in real time.
With more than 22 billion devices shipped and trusted by 400+ customers worldwide, Ceva is the backbone of today’s most advanced smart edge products – from AI-infused wearables and IoT devices to autonomous vehicles and 5G infrastructure. Our differentiated solutions deliver seamless integration into existing design flows, total flexibility to combine solutions based on design needs and ultra‑low‑power performance in minimal silicon footprint, helping customers accelerate development, reduce risk, and bring innovative products to market faster. As technology evolves toward Physical AI, Ceva’s IP portfolio lays the foundation for systems that are always connected, contextually aware, and capable of intelligent, real-time decision-making.
Visit us at www.ceva-ip.com.