TSMC Expects Flat Year for Foundry
Alan Patterson, EETimes
1/13/2017 00:01 AM EST
TAIPEI — Taiwan Semiconductor Manufacturing Co. expects 2017 to be a flat year for the foundry business as momentum in the chip business stalls.
During this year, smartphones, the key driver of semiconductor demand will have revenue growth reaching about 6 percent, according to TSMC, which makes the A10 processor for the Apple iPhone and SoCs for a host of other handsets. That outlook shows some upside compared with an IDC forecast of 3.1 percent growth for 2016, following double-digit gains during the previous two years.
TSMC said it expects low-end smartphones to lead growth with gains reaching 8 percent, while the high-end segment including Apple’s iPhone will expand by 3 percent this year. Even so, TSMC said that silicon content in smartphones will increase in the high single digits.
“We’re running into a little air pocket here,” said TSMC Chairman Morris Chang at a Taipei event today to announce the company’s results during the fourth quarter of 2016.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
|
Related News
- 2022 to Mark the Third Year in a Row of ≥20% Growth for the Foundry Market
- TSMC Continues to Dominate the Worldwide Foundry Market
- Silicon Creations Named 2017 TSMC Partner of the Year for Analog Mixed Signal IP
- Credo Receives Coveted TSMC 2017 Open Innovation Platform® Partner of the Year Specialty Technology IP Award
- Flex Logix Wins TSMC Open Innovation Platform Partner Of The Year Award 2017
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation