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System on Chip design resources
System on Chip design resources
August 3, 2026 -
Competition for leadership in the global semiconductor market is expected to intensify further as the possibility emerges that Taiwan's TSMC, the world's largest foundry (contract chip manufacturer), will move up its mass production schedule for the next-generation 1.4-nanometer (nm; one-billionth of a meter) process. TSMC is accelerating its 1.4nm production, in which it competes with Samsung Electronics, while also developing a technology similar to Intel's latest technology in the chip packaging race.
According to Taiwan's Commercial Times (CTEE) and other outlets on the 31st, the 1.4nm production plant that TSMC is building in the Taichung Science Park is expected to be completed around April next year, as construction has progressed faster than originally planned.
After the plant is completed, trial production is projected to begin from the third quarter of the same year following the installation of production equipment and process verification. After a subsequent yield-stabilization process, the plant is likely to shift to full-scale mass production from 2028. This shows that actual production preparations are progressing more quickly than the next-generation process roadmap TSMC has disclosed.
Samsung Electronics, which has begun commercializing its 1.4nm process, had targeted mass production next year but recently adjusted that timing to 2029. The move is aimed at focusing on optimizing the yield of existing processes rather than forcing an advanced process ahead of schedule. Accordingly, Samsung Electronics is reported to have shared its 1.4nm process plans with chip equipment makers such as Applied Materials and Lam Research and requested advance development of equipment. It has also brought in ASML's next-generation lithography equipment, the High-NA extreme ultraviolet (EUV) system.