Ultra-low power 32 kHz RC oscillator designed in GlobalFoundries 22FDX
Samsung Starts Mass Production of Its 2nd Generation 10nm FinFET Process Technology
New S3 line is now ready for ramp-up to meet the 10nm demand
SEOUL, South Korea-- November 28, 2017 -- Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced that its Foundry Business has commenced mass production of System-on-Chip (SoC) products built on its second generation 10-nanometer (nm) FinFET process technology, 10LPP (Low Power Plus).
10LPP process technology allows up to 10-percent higher performance or 15-percent lower power consumption compared to its first generation 10nm process technology, 10LPE (Low Power Early). As this process is derived from the already proven 10LPE technology, it offers competitive advantages by greatly reducing turn-around time from development to mass production and by providing significantly higher initial manufacturing yield.
SoCs designed with 10LPP process technology will be used in digital devices scheduled to launch early next year and are expected to become more widely available throughout the year.
“We will be able to better serve our customers through the migration from 10LPE to 10LPP with improved performance and higher initial yield,” said Ryan Lee, Vice President of Foundry Marketing at Samsung Electronics. “Samsung with its long-living 10nm process strategy will continue to work on the evolution of 10nm technology down to 8LPP to offer customers distinct competitive advantages for a wide range of applications.”
Samsung also announced that its newest manufacturing line, S3, located in Hwaseong, Korea, is ready to ramp up production of process technologies including 10nm and below. S3 is the third fab of Samsung’s Foundry Business, following S1 in Giheung, Korea and S2 in Austin, USA. Samsung’s 7nm FinFET process technology with EUV (Extreme Ultra Violet) will also be mass produced at S3.
About Samsung Electronics Co., Ltd.
Samsung inspires the world and shapes the future with transformative ideas and technologies. The company is redefining the worlds of TVs, smartphones, wearable devices, tablets, digital appliances, network systems, and memory, system LSI and Foundry. For the latest news, please visit the Samsung Newsroom at http://news.samsung.com.
|
Related News
- Samsung Announces Mass Production of 2nd Generation 14-Nanometer FinFET Logic Process Technology
- Samsung Completes Qualification of its 2nd Generation 10nm Process Technology
- Samsung Electronics on Track for 10nm FinFET Process Technology Production Ramp-up
- Samsung Starts Industry's First Mass Production of System-on-Chip with 10-Nanometer FinFET Technology
- SEMIFIVE Achieves Mass Production Milestone of its SoC Platform
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |