Alan Patterson, EETimes
12/8/2017 00:01 AM EST
TAIPEI — Taiwan Semiconductor Manufacturing Co. (TSMC) said it aims to open its second fab in China earlier than originally expected in order to meet strong demand in the world’s fastest growing semiconductor market.
The company will “pull in” the opening of the fab located in Nanjing, China, to June of next year, according to TSMC Co-CEO Mark Liu, who was the keynote speaker at a company event to commemorate its outstanding ecosystem suppliers.
Two years ago, TSMC said it aimed to begin 16nm production at the fab in the second half of 2018. The planned capacity of TSMC’s wholly owned facility in China is 20,000 12-inch wafers per month on an investment of about $3 billion.
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