8kx8 Bits OTP (One-Time Programmable) IP, X-FA- 0.18μm XH018 Modular Mixed Signal Process
TSMC Sees HPC Driving Business
Alan Patterson, EETimes
1/19/2018 03:42 AM EST
TAIPEI — Taiwan Semiconductor Manufacturing Co. (TSMC) says that high-performance computing (HPC), including demand for chips used in cryptocurrency mining, has replaced smartphones as the key driver of its business.
While low- and mid-tier smartphones still show signs of growth, sales of leading-edge handsets are likely to be “flat”, according to the world’s largest foundry, which makes all of the application processors used in Apple’s latest iPhones as well as silicon used in handsets from a range of Chinese manufacturers such as Huawei, Oppo and Xiaomi.
HPC, which under TSMC’s definition includes applications for AI, GPUs and cryptocurrency mining, is picking up just as smartphone demand is losing momentum, the company said. While AI ASICs such as those used for cryptocurrency mining may to a degree be eroding sales of GPUs, demand for both types of chips is quite “solid”, according to TSMC.
E-mail This Article | Printer-Friendly Page |
|
Related News
- PLDA Joins ETP4HPC to share its expertise in High Speed Interconnect Solution IP with the European High Performance Computing Ecosystem
- Synopsys Accelerates High-Performance Computing SoC Designs with Industry's Broadest IP Portfolio for TSMC's 5nm Process Technology
- Arm and TSMC Demonstrate Industry's First 7nm Arm-based CoWoS Chiplets for High-Performance Computing
- Sidense SHF Embedded Memory Macros Target High-Performance and Low-Power Applications in TSMC 28nm Processes
- JEDEC Unveils Plans for DDR5 MRDIMM and LPDDR6 CAMM Standards to Propel High-Performance Computing and AI
Breaking News
- SIA Statement on Biden Administration Action Imposing New Export Controls on AI Chips
- BrainChip Brings Neuromorphic Capabilities to M.2 Form Factor
- Exostiv Labs Unveils AMD Versal Adaptive SoC Device Support for Exostiv and Exostiv Blade Platforms
- TSMC December 2024 Revenue Report
- NASA Awards Alphacore Four Contracts for Radiation Hardened Microelectronics Innovation
Most Popular
- Eighteen New Semiconductor Fabs to Start Construction in 2025, SEMI Reports
- VeriSilicon's Display Processing IP DC8200-FS has achieved ISO 26262 ASIL B certification
- OPENEDGES and TAKUMI partner to promote ORBIT Memory Subsystem IP in Japan
- CEVA Opens New Research and Development Center in Bristol, U.K.
- TTTech divests strategic stake in landmark transaction to NXP to fuel future growth with technology investments in core business