English
NVM OTP in UMC (180nm, 153nm, 110nm, 90nm, 80nm, 55nm, 40nm, 28nm, 22nm)
China startup releases AI processors then raises $100 million
April 04, 2018 // By Peter Clarke, eeNews
Horizon Robotics Ltd. (Beijing, China), a startup founded in 2015, has released two artificial intelligence processors and raised about $100 million in a funding round with help from Intel Capital.
Horizon is a spin off from the Chinese Academy of Sciences, that is expected to create artificial intelligence products and platforms at the chip, board and system-level aimed at smart driving, smart cities and smart buildings.
The company describes itself as providing a "full-stack solution" including algorithm framework design, compiler and runtime library for the processors, hardware and chip design and deployment together with large-scale training and simulation platform
|
E-mail This Article | 
|
|
Printer-Friendly Page |
Related News
- Celestial AI, the Creator of the Photonic Fabric Optical Interconnect Technology Platform, Raises $100 Million in Series B Funding
- AI Processor Chipmaker Deep Vision Raises $35 Million in Series B Funding
- Hailo Raises $12.5 Million Series A Round to Develop Deep Learning Processor for Embedded AI Applications
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- Israeli AI startup NeuReality raises $35M Series A to bring its novel inferencing chip to the market
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation