Samsung early with 7nm process, says report.
April 09, 2018 // By Peter Clarke, eeNews
Samsung Electronics has completed the development of 7nm manufacturing process technology that makes use of extreme ultra-violet (EUV) lithography, about six months ahead of schedule, according to a report in Seoul Economy Daily.
The process is installed at the Hwaseong S3 production line in South Korea. Samsung is in a race to catch up with foundry leader TSMC which is expected to begin 7nm production in June with Qualcomm, Xilinx and Apple joining HiSilicon as customers.
"The Samsung developers who participated in the development of the 7nm process have completed their mission and moved to 5nm development," the report said quoting an unnamed executive from the semiconductor industry. "We know that they have shared the design database necessary for sample production from customers such as Qualcomm," the report also quoted the official as saying.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
|
Related News
- Cadence Pegasus Verification System Certified for Samsung Foundry 5nm and 7nm Process Technologies
- Samsung Foundry Certifies Analog FastSPICE Platform from Siemens for Early Design Starts on 3nm GAA Process Technology
- Cadence Custom/AMS Flow Certified for the Samsung Foundry 3nm Advanced Process Technology for Early Design Starts
- Samsung Electronics Starts Production of EUV-based 7nm LPP Process
- TSMC Certifies Synopsys IC Compiler II for the Most Advanced 7-nm Process Node Enabling Early Tapeouts
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation