Credo Demonstrates 112G PAM4 and 56G PAM4 SerDes IP Solutions at TSMC 2018 Technology Symposium
SANTA CLARA, Calif., May 01, 2018 -- Credo, a global innovation leader in Serializer-Deserializer (SerDes) technology, today announced it will demonstrate its advanced high performance, low power SerDes IP offerings at this week’s TSMC Technology Symposium, featuring single-lane rate 112G PAM4 and single-lane rate 56Gbps PAM4.
The wide range of Credo SerDes IP solutions enables ASIC, ASSP, and SoC designers to meet the power and performance requirements of a variety of applications including switching, general purpose computing, artificial intelligence, and machine learning all of which are fueling expansion in next generation data center, enterprise, and telco networks.
WHERE:
TSMC Open Innovation Platform Ecosystem Forum
Santa Clara Convention Center
5001 Great America Parkway
Santa Clara, CA 95054
Booth # 403
WHEN:
May 1, 2018
8:30 a.m. – 5:30 p.m.
WHAT:
The TSMC Technology Symposium brings together TSMC's design ecosystem companies and our customers to share practical, tested solutions to today's design challenges. Success stories that illustrate TSMC's design ecosystem best practices highlight the event.
About Credo
Credo is a leading provider of high performance, mixed-signal semiconductor solutions for the data center, enterprise networking and high performance computing markets. Credo's advanced Serializer-Deserializer (SerDes) technology delivers the bandwidth scalability and end-to-end signal integrity for next generation platforms requiring single-lane 25G, 50G, and 100G connectivity. The company makes its SerDes available in the form of Intellectual Property (IP) licensing on the most advanced process nodes and with complementary product families focused on extending reach and multiplexing to higher data rates. Credo has offices in Milpitas, Taiwan, Shanghai and Hong Kong.
For more information: www.credosemi.com
|
Credo Semiconductor Hot IP
Related News
- Credo Demonstrates Single-Lane 112G and 56G PAM4 SerDes IP Solutions at TSMC 2017 OIP Ecosystem Forum
- Credo Demonstrates Single-Lane 112G and 56G PAM-4 SerDes IP at TSMC OIP Forum
- Credo Demonstrates Industry Leading SerDes on TSMC's 7nm Process at TSMC 2018 OIP Forum and Technology Symposium in Amsterdam
- Credo Demonstrates Robust 112G PAM4 Single Lane Electrical SerDes Techology at DesignCon 2018
- Credo Demonstrates 112G PAM4 SR, 56G PAM4 LR, and 56G NRZ SerDes Technology at DesignCon
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |