Munich, June 20, 2018 – T2M, the world’s largest independent global semiconductor IP technology provider today announced that they will be showcasing their latest Cellular and Low Power Wireless IoT technology IP at MWC Shanghai on 27, 28 and 29th June at the Shanghai New International Expo Centre.
Mobile World Congress Shanghai is the must-attend industry event in Asia. With over 60,000 attendees, the event represents the entire mobile and technology eco-system in areas of: Artificial Intelligence, Automotive, Devices and IoT.
At the show, you can experience demos and discuss with T2M experts on our cutting-edge IP:
Cellular IOT SoC IP
- NB-IOT/Cat M1 Phy & PS SW
- NB-IOT RF IP
- GNSS SW IP (DSP/CPU)
- GNSS RF IP & Rx
- GSM Phy & PS SW
Low Power Wireless Connectivity SoC IP Technology (BQB & ZigBee Alliance Certified)
- BLE v5 / 15.4 Digital LL & MAC
- BLE v5 / 15.4 RF IP (0.5mm2)
- BLE v5 SW Stack & Profiles
- Bluetooth Mesh v1.0 SW
- ZigBee v3 SW Stack & Profiles
When: 27 – 29 June, 2018
Location: Shanghai New International Expo Centre
To Book a Meeting, Click here.
T2M is the world's largest independent global semiconductor technology provider, supplying complex IP, software, KGD and disruptive technologies enabling accelerated production of IoT, wireless, consumer and automotive electronics devices. Located in all key tech clusters around the world, our senior management team provides local access to leadership companies and technology. For more information, please visit www.t-2-m.com