EDA Startup Rises From Ashes of ATopTech
Dylan McGrath, EETimes
6/29/2018 00:01 AM EDT
SAN FRANCISCO — A startup, formed from the auctioned assets of ATopTech, showed up at the Design Automation Conference (DAC) here this week open for business and with two well-respected EDA veterans newly added to its leadership team.
Avatar Integrated Systems features substantially all of the technology of ATopTech, including the popular Aprisa and Apogee place-and-route tools used by a number of chip companies. The company also features most of the former employees of ATopTech — including ATopTech co-founder and chief architect Ping San Tzeng — as well as former Cadence Design Systems executives Chi-Ping Hsu and Charlie Huang.
ATopTech filed for bankruptcy last year and put its assets up for sale after losing a long-running legal battle with No. 1 EDA vendor Synopsys. ATopTech’s assets were quietly scooped up in bankruptcy court by Avatar’s Chairman, Jingyuan Han, a Hong Kong businessman and steel magnate who has been listed by Forbes magazine as the 136th richest person in China.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
|
Related News
- China's EDA startup X-Epic forced to lay off staff, says report
- Siemens EDA faces Chinese startup competitor
- Siemens acquires Insight EDA to expand Calibre integrated circuit reliability verification offering
- GBT is Developing an EDA Technology For Automatic Generation of Integrated Circuits Layout IPs
- Siemens acquires Avatar, expands EDA footprint with innovative Place and Route technology
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation