Faraday Unveils the Industry's Smallest USB 2.0 OTG PHY IP
Hsinchu, Taiwan, Aug. 15, 2018 -- Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced the availability of the industry’s smallest USB 2.0 OTG PHY on UMC 40nm. The silicon-proven solution is targeted at consumer applications, such as MFP, DSC, USB portable devices, IoT, wearables, and MCU’s.
Faraday, a leading USB IP provider, continues to invest in this key IP family, delivering optimized solutions that often exceed customer’s requirements. The newly launched USB IP, the smallest in its class, comes with both I²C and APB interfaces for register setting, which can facilitate IP controllability after being integrated into a SoC design; it also reduces the testing cost for mass-production by supporting loopback test mode on the differential IOs.
“Faraday’s USB 2.0 OTG PHY is a cost-effective, feature-rich solution with industry leading silicon area. In addition, Faraday provides a PHY daughter board for system-level FPGA development and verification; the subsystem of PHY and controller is also offered to reduce the engineering effort required for system integration,” said Flash Lin, Chief Operating Officer of Faraday. “This USB 2.0 IP with the same tiny architecture is currently in validation phase on UMC 28nm process nodes and will be available later this year.”
About Faraday Technology Corporation
Faraday Technology Corporation (TWSE: 3035) is a leading ASIC design service and IP provider, certified to ISO 9001 and ISO 26262. The broad silicon IP portfolio includes I/O, Cell Library, Memory Compiler, ARM-compliant CPUs, DDR2/3/4, low-power DDR1/2/3, MIPI, V-by-One, USB 2.0/3.1 Gen 1, 10/100/1000 Ethernet, Serial ATA, PCI Express, and programmable SerDes, etc. Headquartered in Taiwan, Faraday has service and support offices around the world, including the U.S., Japan, Europe, and China. For more information, please visit:www.faraday-tech.com
|
Faraday Technology Corp. Hot IP
Related News
- Faraday's USB 2.0 OTG High Speed IP Core Silicon Proven on UMC's 0.13 um Technology
- Faraday's USB 2.0 OTG IP Cores Receive USB-IF OTG Compliance Certifications
- UMC Announces 22nm Technology Readiness Following Silicon Validation on World's Smallest USB 2.0 Test Vehicle
- Brite's USB 2.0 OTG PHY Implementation Using SMIC 0.11um Process Receives USB-IF Certification
- Rapid Bridge Tapes Out World's Smallest USB 2.0/3.0 PHY
Breaking News
- Premier ASIC and SoC Design Partner Rebrands as Aion Silicon
- Baya Systems, Imagination Technologies and Andes Technology to Present on Heterogeneous Compute Architectures at Andes RISC-V CON Silicon Valley
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Wi-Fi 7 (802.11be) RF Transceiver IP Core Ready for High Speed Wireless Connectivity Applications
Most Popular
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
- BrainChip Extends RISC-V Reach with Andes Technology Integration
- Alphawave Semi Delivers Foundational AI Platform IP for Scale-Up and Scale-Out Networks
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |