October 17, 2019 — AGI Corporation (AGiC), a leading-edged logic-compatible one-time programmable (OTP) memory IP provider specialized in automotive, AIoT and edge computing solutions, announced that AGiC C-Fuse OTP memory uses AGiC Particle Momentum (APM) to control atom movement in semiconductor. Except from non-destructive PGM mechanism, the key feature of high security makes C-Fuse ideal for IoT device.
Embedded OTP is an important part in most IoT devices. The IoT market includes commercial products, FinTech, automotive industry, etc. In Cisco’s report, over 50 billion devices will be connected to the internet by 2020. As the numbers keep scaling up, many important data, such as FinTech transactions, or biometric recognition, will be exchanged through those applications, which require high security.
The OTP memory inside these IoT devices must have the highest level of physical security. High security is crucial for storage the code, key, and data. Those data cannot be reversed via either physical or electrical analysis. It makes the OTP ideal for encryption keys, ID tags, and other security applications.
APM Toward Inherently High Security Feature
To meet these needs, the OTP requires a unique PGM mechanism. By APM controlling atom movement in semiconductor, AGiC C-Fuse OTP is an ideal solution. Figure 1. Shows the inherent security feature of AGIC C-Fuse OTP.
Figure 1. Programmed and unprogrammed C-Fuse
With non-destructive PGM mechanism in fuse-type OTP, it is difficult to determine which cell has been programmed or its resistance. The cell resistance will only be reserved to customer defined code value for ultimate physical high security in IoT applications. “Even if breaking the gatekeeper, one has no clue to break the customer defined code value,” said Andromeda, VP of AGiC.
In addition, C-Fuse OTP minimizes bit-cell size to provide competitive area and can be fabricated in standard CMOS processes with no additional masks or process steps. For IoT markets that require high security features, C-Fuse OTP supports processes from 180nm to 7nm FinFET and beyond to take advantage of performance and area benefits.
AGiC Technology C-Fuse OTP Provides Following Benefits:
- High-Temp Immunity (>400°C~1000°C).
- Portable across all process nodes including CMOS Logic, BCD, eHV, DRAM, etc.
- No additional masks.
- No additional steps.
- No special/material requested.
- Support geometry from 350 nm to 5 nm and beyond.
- Qualification for AEQ-100 Grade 0 requirements.
- MLC feature for high security requirement.
Welcome to visit our website and contact with us for more detail presentation and discussion.
Artificial General Intelligence Cosmos IP total solution.
AGiC Website: www.agicip.com