Cadence Expands Collaboration with Broadcom for 5nm and 7nm Designs
SAN JOSE, Calif., 14 Jan 2020 -- Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that it expanded its collaboration with Broadcom Inc. for the creation of semiconductor solutions targeting next-generation networking, broadband, enterprise storage, wireless and industrial applications. Building upon successful 7nm designs, Cadence and Broadcom are expanding the collaboration to include the creation of 5nm designs using Cadence® digital implementation solutions. With these Cadence solutions in place, Broadcom can further augment engineering productivity and improve silicon performance and power.
“As a global infrastructure technology leader, we’re committed to delivering innovative products that enable our customers to excel in their respective markets,” said Yuan Xing Lee, vice president and head, Central Engineering at Broadcom Inc. “With Cadence as a key silicon design partner, we’re able to achieve our power and performance goals and provide our customers with the highest quality solutions that they’ve come to expect from us.”
“We’ve collaborated with Broadcom for many years, and our expanded partnership on advanced-node design development is a result of the series of successes we’ve had together over time and our overall digital technology leadership,” said Dr. Anirudh Devgan, president of Cadence. “Given the continued proliferation of networking, broadband, enterprise storage, wireless and industrial applications, we’re dedicated to ensuring that Broadcom achieves design excellence using our latest toolsets to fuel design innovation.”
The Cadence digital implementation solutions are part of the broader digital suite, which provides optimal power, performance and area (PPA) and reduced turnaround time. The tools support Cadence’s Intelligent System Design™ strategy, which enables systems and semiconductor companies to achieve system-on-chip (SoC) design excellence more efficiently. For more information on the digital suite, visit www.cadence.com/go/dspr.
About Cadence
Cadence enables electronic systems and semiconductor companies to create the innovative end products that are transforming the way people live, work and play. Cadence® software, hardware and semiconductor IP are used by customers to deliver products to market faster. The company’s Intelligent System Design strategy helps customers develop differentiated products—from chips to boards to intelligent systems—in mobile, consumer, cloud, data center, automotive, aerospace, IoT, industrial and other market segments. Cadence is listed as one of Fortune Magazine's 100 Best Companies to Work For. Learn more at www.cadence.com.
|
Cadence Hot IP
Related News
- Synopsys Expands Collaboration with Broadcom for 7nm and 5nm Designs
- Cadence Expands Collaboration with TSMC and Microsoft to Accelerate Timing Signoff for Giga-Scale Designs on the Cloud
- Cadence Expands Collaboration with ARM to Accelerate Custom SoC and IoT System Designs with Industry's First End-to-End Hosted Design Solution
- Cadence Expands Collaboration with Samsung Foundry, Providing Differentiated Reference Flows Based on the Integrity 3D-IC Platform
- Cadence Expands Collaboration with Samsung Foundry to Advance 3D-IC Design
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |