Fully Digital Physically Unclonable Function (PUF) - PQC Ready
Politics Haunts TSMC's US Fab Plan
By Alan Patterson, EETimes (May 19, 2020)
TAIPEI – The announcement by Taiwan Semiconductor Manufacturing Co. (TSMC) last week to build a fab in the United States was very likely motivated by a number of political factors, according to people with knowledge of the matter. It’s a move that could haunt TSMC and its future.
On May 15, the company announced it will build a 5nm fab in the U.S. state of Arizona with support from that state and the U.S. federal government. Hours after the TSMC news broke, the U.S. Department of Commerce announced new restrictions on TSMC’s second-largest customer, HiSilicon of China. People say the two events were related to the issue of U.S. export control.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
|
Related News
Breaking News
- Alphawave Semi Opens Pune Office, Continues Expansion into India
- SynSense closes USD$10m Pre-B+round to bring their ultra-low-power vision processing SOC "Speck™" to mass production
- Global Fab Equipment Spending on Track for 2024 Recovery After 2023 Slowdown, SEMI Reports
- OPENEDGES Completes the Tapeout of the 7nm HBM3 Memory Subsystem (PHY & Memory Controller) Test chip
- Andes Custom Extension™ (ACE) Supports AndesCore™ 45-Series Processors to Provide Flexible Acceleration
Most Popular
- OPENEDGES Completes the Tapeout of the 7nm HBM3 Memory Subsystem (PHY & Memory Controller) Test chip
- SoftBank and EdgeCortix Partner to Jointly Realize Low-latency and Highly Energy-efficient 5G Wireless Accelerators
- Andes Custom Extension™ (ACE) Supports AndesCore™ 45-Series Processors to Provide Flexible Acceleration
- CEO Interview: Ian Lankshear, EnSilica
- Renesas to Acquire Panthronics to Extend Connectivity Portfolio with Near-Field Communication Technology