Huawei to end production of leading edge mobile chipsets
By David Manners, Electronics Weekly (August 10, 2020)
Huawei is to end production of its top-of-the- range Kirin mobile processors in September, according to Caixin Global, the Chinese state news site.
“From Sept. 15 onward, our flagship Kirin processors cannot be produced,” Richard Yu (pictured) CEO of Huawei’s consumer unit said at the recent Mate 40 launch, “our AI-powered chips also cannot be processed. This is a huge loss for us.”
The US has barred any fab which uses US manufacturing equipment from making chips for Huawei’s chip subsidiary HiSilicon.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- X-Silicon Introduces the World's First Vulkan Driver Implementation for RISC-V, Enabling an entire Ecosystem of 3D Graphics, AI and Compute for Low-Power, Mobile, Edge and IOT Devices
- Synopsys and Samsung Electronics Collaborate to Achieve First Production Tapeout of Flagship Mobile CPU with Leading Performance on Samsung Foundry's GAA Process
- First Generation SiMa.ai Edge AI Platform Enters Mass Production Amidst Surge in Company Momentum
- Flex Logix Announces Production Availability of InferX X1M Boards for Edge AI Vision Systems
- Flex Logix Announces Production Availability Of InferX X1 PCIe Boards for Edge AI Systems
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation