US Tightens Chip Export Screws on Huawei
By George Leopold, EETimes (August 17, 2020)
The Trump Administration has moved to tighten chip export screws on China, further restricting access to U.S. advanced semiconductor manufacturing gear by adding more Huawei Technologies affiliates to its list of required licensees.
Caught unawares, the U.S. semiconductor industry groups expressed surprise at what one executive called the administration’s “sudden shift” away from a narrower approach to controlling chip gear exports.
The U.S. Commerce Department said Monday (Aug. 17) it will add 38 Huawei affiliates to its Entity List of companies required to obtain export licenses to purchase advanced U.S. chip technologies. The expanded list follows a May decision to slap stiffer U.S. export controls on American chip design software and manufacturing equipment. The new rules specifically target Huawei, its HiSilicon chip unit and other affiliates in an attempt to cut off access to leading edge chip technology.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- Analysts Debate Latest U.S. Export Controls
- U.S. Ban on Huawei Seen Widening China Chip War
- China's Semiconductor Industry to Brace for Impact as SMIC Assesses Export Restrictions Placed by U.S., Says TrendForce
- TrendForce Analyzes Impacts of Expanded U.S. Sanctions Against Huawei on Five Major Tech Industries
- US Grants 90-Day Reprieve for Huawei Suppliers
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation