TSMC Sees HPC As Next Inflection Point
By Alan Patterson, EETimes (October 20, 2020)
TAIPEI — Taiwan Semiconductor Manufacturing Co. (TSMC) expects the main driver of its growth in the next several years to be high-performance computing (HPC), overtaking its current smartphone business.
The world’s biggest chip foundry said its technology leadership during the third quarter this year helped it capture 5G and HPC orders that will increase company growth by about 30% in 2020, leading overall gains in the semiconductor industry.
The company made those predictions in spite of losing sales to China’s Huawei, which has been blacklisted by the US government in the tech war between the world’s two biggest economies. TSMC said its sales to Huawei, in 2020 its second-largest customer after Apple, will drop to zero in the fourth quarter this year in compliance with US regulations. The company has apparently had no trouble compensating for the loss of Huawei’s business, however; TSMC has had difficulty meeting customer demand as capacity utilization nears full loading.
E-mail This Article | Printer-Friendly Page |
|
Related News
- TSMC Sees HPC Driving Business
- Analysts sees 'PLD inflection point'
- Synopsys Advances Designs on TSMC N3E Process with Production-Proven EDA Flows and Broadest IP Portfolio for AI, Mobile and HPC Applications
- Synopsys Drives Chip Innovation for Next-Generation Mobile and HPC Designs on TSMC N3E and N4P Processes
- GUC Tapes Out AI/HPC/Networking Platform on TSMC CoWoS Technology Validating 7.2 Gbps HBM3 Controller and PHY, GLink-2.5D and 112G-LR SerDes IPs
Breaking News
- PUFsecurity Unveils Next-Gen Crypto Coprocessor PUFcc7 Featuring High-speed Performance and TLS 1.3 Support
- SEMIFIVE Starts Mass Production of its 14nm AI Inference SoC Platform based Product
- VeriSilicon's complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification
- TASKING and Andes Announce FuSa Compliant Compiler Support for Andes RISC-V ASIL Compliant Automotive IP
- Efabless Launches an "AI Wake Up Call" Open-Source Silicon Design Challenge
Most Popular
- Qualitas Semiconductor and Ambarella Sign Licensing Agreement
- ZeroPoint Technologies Signs Global Customer to Bring Hardware-Accelerated Compression to Hyperscale Data Centers
- Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generative AI Chips
- Intel and Arm Team Up to Power Startups
- Alphawave Semi and InnoLight Collaborate to Demonstrate Low Latency Linear Pluggable Optics with PCIe 6.0® Subsystem Solution for High-Performance AI Infrastructure at OFC 2024