10G/2.5G/1G Multi-Speed Ethernet Controller IP for Automotive Applications
North American Semiconductor Equipment Industry Posts November 2020 Billings
MILPITAS, Calif. — December 23, 2020 — North America-based manufacturers of semiconductor equipment posted $2.61 billion in billings worldwide in November 2020 (three-month average basis), according to the November Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI. The billings figure is 1.4 percent lower than the final October 2020 level of $2.65 billion, and is 23.1 percent higher than the November 2019 billings level of $2.1 billion.
“Billings of North America-based semiconductor equipment manufacturers remain robust, though November shows some expected tapering after billings registered record highs early this fall,” said Ajit Manocha, SEMI president and CEO.
The SEMI Billings report uses three-month moving averages of worldwide billings for North American-based semiconductor equipment manufacturers. Billings figures are in millions of U.S. dollars.
Billings | Year-Over-Year | |
June 2020 | $2,317.7 | 14.4% |
July 2020 | $2,575.3 | 26.7% |
August 2020 | $2,653.3 | 32.5% |
September 2020 | $2,743.3 | 40.0% |
October 2020 (final) | $2,648.2 | 27.3% |
November 2020 (prelim) | $2,611.6 | 23.1% |
Source: SEMI (www.semi.org), December 2020
SEMI publishes a monthly North American Billings report and issues the Worldwide Semiconductor Equipment Market Statistics (WWSEMS) report in collaboration with the Semiconductor Equipment Association of Japan (SEAJ). The WWSEMS report currently reports billings by 24 equipment segments and by seven end market regions. SEMI also has a long history of tracking semiconductor industry fab investments in detail on a company-by-company and fab-by-fab basis in its World Fab Forecast and SEMI FabView databases. These powerful tools provide access to spending forecasts, capacity ramp, technology transitions, and other information for over 1,000 fabs worldwide. For an overview of available SEMI market data, please visit www.semi.org/en/MarketInfo.
The data contained in this release were compiled by David Powell, Inc., an independent financial services firm, without audit, from data submitted directly by the participants. SEMI and David Powell, Inc. assume no responsibility for the accuracy of the underlying data.
About SEMI
SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more
|
Related News
- North American Semiconductor Equipment Industry Posts November 2021 Billings
- North American Semiconductor Equipment Industry Posts December 2020 Billings
- North American Semiconductor Equipment Industry Posts October 2020 Billings
- North American Semiconductor Equipment Industry Posts September 2020 Billings
- North American Semiconductor Equipment Industry Posts August 2020 Billings
Breaking News
- CXL Consortium Announces Compute Express Link 3.2 Specification Release
- Synopsys Posts Financial Results for Fourth Quarter and Fiscal Year 2024
- Alphawave IP - Announcement regarding leadership transition
- Global Semiconductor Sales Increase 22.1% Year-to-Year in October; Annual Sales Projected to Increase 19.0% in 2024
- Qualitas Semiconductor's MIPI D-PHY IP Powers Mass Production of Renesas AI MPU
Most Popular
- Now Gelsinger is gone, what is Intel's Plan B?
- SmartDV Licenses SDIO IP Family to Ranix for V2X Products
- Intel CEO's Departure Leaves Top U.S. Chipmaker Adrift
- IP players prominent in chiplet's 2024 diary
- Marvell Unveils Industry's First 3nm 1.6 Tbps PAM4 Interconnect Platform to Scale Accelerated Infrastructure
E-mail This Article | Printer-Friendly Page |