Arteris IP FlexNoc Interconnect and Resilience Package Licensed by Hailo for Artificial Intelligence (AI) Chip
Leading AI chipmaker Hailo uses world-leading network-on-chip (NoC) IP to accelerate dataflow performance
CAMPBELL, Calif. – January 12, 2021 – Arteris IP, the world’s leading supplier of innovative, silicon-proven network-on-chip (NoC) interconnect intellectual property, today announced that Hailo has licensed FlexNoC Interconnect IP and the accompanying Resilience Package for use in Hailo’s AI processor targeting automotive, smart cities, smart retail, Industry 4.0 and other markets.
Hailo’s AI processor is transforming visual intelligence and sensory perception for multiple industries by enabling smart devices to run neural network (NNs)-based applications more effectively at the edge. The Arteris interconnect IP products will be used by Hailo to improve the dataflow performance.
“The Arteris IP FlexNoC interconnect is much more area efficient than competitive technologies,” said Orr Danon, CEO of Hailo. “The state-of-the-art interconnect IP reduces the die area and power consumption of our unique architecture, which helps us to meet the market requirements.”
“Hailo is an AI innovator and their choice of our FlexNoC Interconnect IP and Resilience Package is a resounding vote of confidence in Arteris IP NoC technology,” said K. Charles Janac, President and CEO of Arteris IP. “The Hailo engineering team’s choice of Arteris IP is further proof of our technology’s benefits for optimizing on-chip dataflow for AI/ML and automotive systems.”
About Arteris IP
Arteris IP provides network-on-chip (NoC) interconnect IP and IP deployment technology to accelerate system-on-chip (SoC) semiconductor development and integration for a wide range of applications from AI to automobiles, mobile phones, IoT, cameras, SSD controllers, and servers for customers such as Bosch, Baidu, Mobileye, Samsung, Toshiba and NXP. Arteris IP products include the Ncore® cache coherent and FlexNoC® non-coherent interconnect IP, the CodaCache® standalone last level cache, and optional Resilience Package (ISO 26262 functional safety), FlexNoC AI Package, and PIANO® automated timing closure capabilities. Customer results obtained by using Arteris IP products include lower power, higher performance, more efficient design reuse and faster SoC development, leading to lower development and production costs. For more information, visit www.arteris.com.
|
Arteris Hot IP
Related News
- Arteris IP FlexNoC Interconnect and AI Package Licensed by Vastai Technologies for Artificial Intelligence Chips
- Arteris IP FlexNoC Interconnect and Resilience Package Licensed by Black Sesame for ISO 26262-Compliant AI Chips for ADAS
- Arteris IP FlexNoC Interconnect Licensed by Lynxi Technologies for Artificial Intelligence (AI) Chips
- Arteris IP Announces New FlexNoC 4 Interconnect IP with Artificial Intelligence (AI) Package
- Arteris FlexNoC Interconnect IP Licensed by Enflame (Suiyuan) Technology for Multiple Artificial Intelligence (AI) Chips
Breaking News
- TSMC November 2023 Revenue Report
- Getting Ready for IoT Security in the AI Era
- CEA-Leti Paper in Nature Communications Reports First Complete Memristor-Based Bayesian Neural Network Implementation For Real-World Task
- Siemens' new Calibre DesignEnhancer boosts Samsung Foundry design quality and speeds time to market
- Bluetooth Channel Sounding: Achieving 10cm Ranging Accuracy
Most Popular
- Pragmatic Semiconductor secures £182m ($231m) investment led by M&G and UK Infrastructure Bank
- Cadence Signoff Solutions Empower Samsung Foundry's Breakthrough Success on 5G Networking SoC Design
- Top 10 Foundries Experience 7.9% QoQ Growth in 3Q23, with a Continued Upward Trend Predicted for Q4, Says TrendForce
- What Is Holding Back Neuromorphic Computing?
- Lattice Collaborates with NVIDIA to Accelerate Edge AI
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |